Patents by Inventor Ryosuke Kumagai

Ryosuke Kumagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961229
    Abstract: In this invention, a control unit in an ophthalmic image processing device acquires an ophthalmic image captured by an ophthalmic image capture device (S11). The control unit, by inputting the ophthalmic image into a mathematical model that has been trained by a machine-learning algorithm, acquires a probability distribution in which the random variables are the coordinates at which a specific site and/or a specific boundary of a tissue is present within a region of the ophthalmic image (S14). On the basis of the acquired probability distribution, the control unit detects the specific boundary and/or the specific site (S16, S24).
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: April 16, 2024
    Assignee: NIDEK CO., LTD.
    Inventors: Ryosuke Shiba, Sohei Miyazaki, Yusuke Sakashita, Yoshiki Kumagai, Naoki Takeno
  • Patent number: 11961863
    Abstract: An imaging element including: a photoelectric conversion layer including a compound semiconductor material; a contact layer disposed to be stacked on the photoelectric conversion layer and including a diffusion region of first electrically-conductive type impurities in a selective region; a first insulating layer provided to be opposed to the photoelectric conversion layer with the contact layer interposed therebetween and having a first opening at a position facing the diffusion region; and a second insulating layer provided to be opposed to the contact layer with the first insulating layer interposed therebetween and having a second opening that communicates with the first opening and is smaller than the first opening.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: April 16, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yuya Kumagai, Shuji Manda, Shunsuke Maruyama, Ryosuke Matsumoto
  • Publication number: 20230158517
    Abstract: There is provided a shower head electrode assembly of a plasma processing apparatus, comprising: an electrode having a plurality of first gas flow paths and having a surface exposed to plasma; and a backing member attached to the electrode and having a plurality of second gas flow paths which communicate with the plurality of first gas flow paths. Each of the plurality of second gas flow paths is a slit-shaped elongated hole, and is configured such that a length of the elongated hole in radial direction is longer than a length of the elongated hole in circumferential direction with respect to a central axis of the shower head electrode assembly.
    Type: Application
    Filed: November 15, 2022
    Publication date: May 25, 2023
    Applicant: Tokyo Electron Limited
    Inventors: Ryosuke KUMAGAI, Hidetoshi HANAOKA, Fumiaki ARIYOSHI
  • Publication number: 20200292654
    Abstract: An antenna apparatus 1 includes a recess 3 formed in a part of a conveyance or a building, an antenna element 4 disposed in the recess 3, and a cover or an insulating material closing a mouth 3b of the recess 3. The recess 3 includes a bottom 3a, the mouth 3b and a side wall 3c connecting the bottom 3a and the mouth 3b, a shape of the recess 3 widens from the bottom 3a toward the mouth 3b, and the bottom 3a and the side wall 3c are made of a conductor. An array antenna configured to detect an incoming direction of a radio wave is formed by a plurality of antenna elements 4.
    Type: Application
    Filed: March 30, 2017
    Publication date: September 17, 2020
    Applicant: NEC Corporation
    Inventor: Ryosuke KUMAGAI
  • Publication number: 20090283574
    Abstract: A wiring board includes an insulating layer having a plurality of through holes formed therein, a base substrate layer positioned below the insulating layer, and a plurality of electrodes disposed on the base substrate layer, each electrode having an exposed surface exposed from a respective through hole, each exposed surfaces being coated with a flux. A plurality of solder balls are disposed on the fluxes in the through holes, respectively. An apparatus for mounting the solder balls on the plurality of electrodes includes: a solder ball removing unit configured to remove a first plurality of solder balls located other than in the through holes; and a solder ball pressing unit configured to press a second plurality of solder balls individually disposed in the through holes towards respective electrodes and into respective flux.
    Type: Application
    Filed: May 8, 2009
    Publication date: November 19, 2009
    Inventors: Ryuichi OKAZAKI, Ryosuke Kumagai, Takuya Hando, Hajime Okamoto, Motonobu Kurahashi