Abstract: Provided is a laminate having, on a substrate, a gel layer which is excellent in heat resistance, has low elastic modulus, low stress and is excellent in stress buffering properties and flexibility, is soft and excellent in holding property of electronic components before curing, and after curing, the gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing, and a method for manufacturing the same. Also provided is a method for manufacturing an electronic component in which use of the laminate makes it difficult to cause problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and makes it difficult to cause problems of defects or defective products of the electronic component. The laminate includes a curing reactive silicone gel layer on at least one type of substrate.

Abstract: A curing reactive silicone gel is provided. The curing reactive silicone gel is obtained by primarily curing a composition containing the following components in a gel form and further having secondarily curing reactivity. (A) an organopolysiloxane having at least two curing reactive groups in one molecule; (B) optionally, an organohydrogenpolysiloxane; and (C) a curing agent.

Abstract: Provided is a laminate having, on a substrate, a gel layer which is excellent in heat resistance, has low elastic modulus, low stress and is excellent in stress buffering properties and flexibility, is soft and excellent in holding property of electronic components before curing, and after curing, the gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing, and a method for manufacturing the same. Also provided is a method for manufacturing an electronic component in which use of the laminate makes it difficult to cause problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and makes it difficult to cause problems of defects or defective products of the electronic component. The laminate includes a curing reactive silicone gel layer on at least one type of substrate.

Abstract: Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.

Abstract: A curing reactive silicone gel is provided. The curing reactive silicone gel is obtained by primarily curing a composition containing the following components in a gel form and further having secondarily curing reactivity. (A) an organopolysiloxane having at least two curing reactive groups in one molecule; (B) optionally, an organohydrogenpolysiloxane; and (C) a curing agent.

Abstract: Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.

Abstract: A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; optionally, (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst. A curable hot-melt silicone is obtained by subjecting the curable silicone composition to a hydrosilylation reaction to a degree that does not form a cured product. The curable hot-melt silicone is non-flowable at 25° C. and has a melt viscosity at 100° C. of 5000 Pa·s or less. The curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. The curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.

Abstract: Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.

Abstract: A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; optionally, (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst. A curable hot-melt silicone is obtained by subjecting the curable silicone composition to a hydrosilylation reaction to a degree that does not form a cured product. The curable hot-melt silicone is non-flowable at 25° C. and has a melt viscosity at 100° C. of 5000 Pa·s or less. The curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. The curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.