Abstract: Provided is copper foil with a resin layer, the resin layer having excellent adhesion, the copper foil exhibiting low dielectric characteristics, which is suitable for high-frequency applications, the copper foil being capable of exhibiting excellent characteristics of reducing transmission loss. More specifically, a laminate of copper foil and an epoxy resin composition layer is provided, the epoxy resin composition layer being present on at least one surface of the foil, the epoxy resin composition containing an epoxy resin and an acid-modified polyolefin, wherein a test piece composed of the laminate and a prepreg has 90-degree peel strength between the copper foil and the prepreg of 0.6 N/mm or more as measured in accordance with JISC6481, and has a reduction rate of the 90-degree peel strength between the copper foil and the prepreg of 20% or less after immersion of the test piece in boiling water for 2 hours.

Abstract: Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25° C. after storage for 168 hours under conditions of 85° C. and 85% RH (relative humidity).

Abstract: Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

Abstract: Provided is an epoxy resin composition that gives a cured product having excellent adhesion to metal and low dielectric characteristics, and that has good workability during use and high storage stability. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a specific phenol-based curing agent.

Abstract: Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.

Abstract: Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.

Abstract: Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.

Abstract: The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): wherein Y is a bond, a C1-6 alkylene group, etc.; R1 is the same or different, and is a C1-18 alkyl group, etc., R2 is the same or different, and is a C1-18 alkylene group, etc., R3 is the same or different, and is a C1-18 alkyl group, etc.

Abstract: Provided is an epoxy resin composition that has excellent electric characteristics (particularly low dielectric tangent), and that can achieve high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising an active ester compound and an epoxy resin having a specific structure.

Abstract: Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

Abstract: The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): wherein Y is a bond, a C1-6 alkylene group, etc.; R1 is the same or different, and is a C1-18 alkyl group, etc., R2 is the same or different, and is a C1-18 alkylene group, etc., R3 is the same or different, and is a C1-18 alkyl group, etc.

Abstract: Provided are an epoxy resin composition that can achieve a sufficiently low viscosity without using a diluent (an organic solvent), and a method for producing the same. Also provided are an epoxy resin composition that can preferably achieve, when cured, good electrical characteristics (particularly low dielectric constant and low dielectric loss tangent), high adhesion strength to metal, and good water absorption characteristics; and a method for producing the same.

Abstract: Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.

Abstract: Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.

Abstract: Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.

Abstract: The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): wherein Y is a bond, a C1-6 alkylene group, etc.; R1 is the same or different, and is a C1-18 alkyl group, etc., R2 is the same or different, and is a C1-18 alkylene group, etc., R3 is the same or different, and is a C1-18 alkyl group, etc.

Abstract: Provided are an epoxy resin composition that can achieve a sufficiently low viscosity without using a diluent (an organic solvent), and a method for producing the same. Also provided are an epoxy resin composition that can preferably achieve, when cured, good electrical characteristics (particularly low dielectric constant and low dielectric loss tangent), high adhesion strength to metal, and good water absorption characteristics; and a method for producing the same.