Patents by Inventor Ryota Seno

Ryota Seno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device and method for manufacturing light emitting device
    Patent number: 10230034
    Abstract: A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: March 12, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Ryota Seno, Kazuhiro Kamada
  • LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
    Publication number: 20180123006
    Abstract: A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).
    Type: Application
    Filed: December 18, 2017
    Publication date: May 3, 2018
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Ryota SENO, Kazuhiro KAMADA
  • LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
    Publication number: 20160035952
    Abstract: A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).
    Type: Application
    Filed: October 15, 2015
    Publication date: February 4, 2016
    Applicant: Nichia Corporation
    Inventors: Motokazu YAMADA, Ryota Seno, Kazuhiro Kamada
  • Light emitting device and method for manufacturing light emitting device
    Patent number: 9196805
    Abstract: A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: November 24, 2015
    Assignee: NICHIA CORPORATION
    Inventors: Motokazu Yamada, Ryota Seno, Kazuhiro Kamada
  • Semiconductor device and method of manufacturing the semiconductor device
    Patent number: 8759987
    Abstract: Disclosed are: a semiconductor device that comprises a semiconductor element to which a plurality of wires are bonded, wherein bonding strength of the wires is high and sufficient bonding reliability is achieved; and a method for manufacturing the semiconductor device. Specifically disclosed is a semiconductor device which is characterized by comprising a first wire that has one end bonded onto an electrode and the other end bonded to a second bonding point that is out of the electrode, and a second wire that has one end bonded onto the first wire on the electrode and the other end bonded to a third bonding point that is out of the electrode. The semiconductor device is also characterized in that the bonded portion of the first-mentioned end of the second wire covers at least apart of the upper surface and the lateral surface of the first wire.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: June 24, 2014
    Assignee: Nichia Corporation
    Inventor: Ryota Seno
  • LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
    Publication number: 20130037842
    Abstract: A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).
    Type: Application
    Filed: January 28, 2011
    Publication date: February 14, 2013
    Inventors: Motokazu Yamada, Ryota Seno, Kazuhiro Kamada
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
    Publication number: 20120193791
    Abstract: Disclosed are: a semiconductor device that comprises a semiconductor element to which a plurality of wires are bonded, wherein bonding strength of the wires is high and sufficient bonding reliability is achieved; and a method for manufacturing the semiconductor device. Specifically disclosed is a semiconductor device which is characterized by comprising a first wire that has one end bonded onto an electrode and the other end bonded to a second bonding point that is out of the electrode, and a second wire that has one end bonded onto the first wire on the electrode and the other end bonded to a third bonding point that is out of the electrode. The semiconductor device is also characterized in that the bonded portion of the first-mentioned end of the second wire covers at least apart of the upper surface and the lateral surface of the first wire.
    Type: Application
    Filed: October 7, 2010
    Publication date: August 2, 2012
    Inventor: Ryota Seno