Abstract: A motor drive device assembly capable of suppressing differences in temperatures of motor drive devices depending on operational conditions. The motor drive device assembly includes a first motor drive device including a first heatsink, a second motor drive device located adjacent to the first motor drive device and including a second heatsink formed separately from the first heatsink, and a connection part connecting the first heatsink and the second heatsink to each other, to allow thermal conduction between the first heatsink and the second heatsink.

Abstract: A motor drive device driving any of a feed shaft or spindle of a machine tool or arm of an industrial machine or industrial robot etc., comprising a current detecting part detecting a motor current, a current control part using an output from the current detecting part as the basis to output a command value to the motor, and a power converting part using a current command as the basis to supply power to the motor, the current detecting part comprising a current slope detecting part and a switching part using an output of the current slope detecting part to switch a plurality of filter characteristics to switch a mode of current detection. The switching part switches to a filter with a narrow/a broad bandwidth when the slope of the current is small/large to thereby improve the precision of current detection.

Abstract: A motor drive device assembly capable of suppressing differences in temperatures of motor drive devices depending on operational conditions. The motor drive device assembly includes a first motor drive device including a first heatsink, a second motor drive device located adjacent to the first motor drive device and including a second heatsink formed separately from the first heatsink, and a connection part connecting the first heatsink and the second heatsink to each other, to allow thermal conduction between the first heatsink and the second heatsink.

Abstract: A motor drive device driving any of a feed shaft or spindle of a machine tool or arm of an industrial machine or industrial robot etc., comprising a current detecting part detecting a motor current, a current control part using an output from the current detecting part as the basis to output a command value to the motor, and a power converting part using a current command as the basis to supply power to the motor, the current detecting part comprising a current slope detecting part and a switching part using an output of the current slope detecting part to switch a plurality of filter characteristics to switch a mode of current detection. The switching part switches to a filter with a narrow/a broad bandwidth when the slope of the current is small/large to thereby improve the precision of current detection.

Abstract: A temperature calculation unit calculates a temperature T1 of one power semiconductor chip as a temperature estimating target, from a reference temperature, a temperature difference ?T1, and a temperature difference ?T2. The temperature difference ?T1 is calculated based on an electric power loss Q1 generated in all power semiconductor chips of a power semiconductor module containing one power semiconductor chip as the temperature estimating target. The temperature difference ?T2 is calculated based on the electric power loss Q1 and an electric power loss Q2 generated in all power semiconductor chips of a power semiconductor module other than the power semiconductor module containing one power semiconductor chip as the temperature estimating target.

Abstract: A temperature calculation unit calculates a temperature T1 of one power semiconductor chip as a temperature estimating target, from a reference temperature, a temperature difference ?T1, and a temperature difference ?T2. The temperature difference ?T1 is calculated based on an electric power loss Q1 generated in all power semiconductor chips of a power semiconductor module containing one power semiconductor chip as the temperature estimating target. The temperature difference ?T2 is calculated based on the electric power loss Q1 and an electric power loss Q2 generated in all power semiconductor chips of a power semiconductor module other than the power semiconductor module containing one power semiconductor chip as the temperature estimating target.