Patents by Inventor Ryuichi Fukunishi

Ryuichi Fukunishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic chuck and method of attracting wafer
    Patent number: 5777838
    Abstract: An electrostatic chuck including an electrode having first and second surfaces, a dielectric member having a first layer for covering at least the first surface of the electrode, a power supply for conducting electric power to the electrode, and a cooling gas-feeding means for feeding a cooling gas onto the surface of the first layer of the dielectric member. A plurality of fine projections 28 are formed on the surface of the first layer of the dielectric member. Each of the fine projections 28 has a tip smaller than a root thereof so as to hold a wafer W in substantially a point-contact manner. The wafer can be held on the surface of the first layer of the dielectric member and cooled by the cooling gas fed from the cooling gas-feeding means.
    Type: Grant
    Filed: November 20, 1996
    Date of Patent: July 7, 1998
    Assignee: Fujitsu Limited
    Inventors: Koki Tamagawa, Kojiro Takahashi, Takahiko Suzuki, Ryuichi Fukunishi