Patents by Inventor Ryuichi Tanaka
Ryuichi Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11996445Abstract: A carbon nanotube composite is described that can be accurately applied to a desired position by inkjet and a dispersion liquid using the same, where a main object is a carbon nanotube composite in which a conjugated polymer is attached to at least a part of the surface of a carbon nanotube, the conjugated polymer having a side chain represented by general formula (1): wherein R, X and A are defined as described.Type: GrantFiled: September 17, 2019Date of Patent: May 28, 2024Assignee: TORAY INDUSTRIES, INC.Inventors: Kazuki Isogai, Seiichiro Murase, Ryuichi Tanaka, Hidekazu Nishino
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Publication number: 20240172284Abstract: Provided is a communication device including a control unit configured to perform control for: exchanging a frame with another communication device wirelessly by using a plurality of links; transmitting, to the another communication device, a first frame including a request for acquisition of a transmission right on a first link by using the first link; generating a third frame including information for triggering the another communication device to acquire a transmission right on a second link different from the first link in a case where a second frame including permission to acquire the transmission right on the first link is received, the second frame being transmitted from the another communication device by using the first link; and transmitting the third frame to the another communication device by using the first link. The present technology can be applied to, for example, communication devices that constitute a wireless LAN system.Type: ApplicationFiled: January 24, 2022Publication date: May 23, 2024Applicant: Sony Group CorporationInventors: Ken TANAKA, Shigeru SUGAYA, Ryuichi HIRATA
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Publication number: 20240172216Abstract: Provided is a communication device that performs wireless communication using a plurality of links such that a difference between transmission end times of respective links is within a predetermined range. A communication device includes a first communication unit that performs communication on a first link, a second communication unit that performs communication on a second link, and a control unit that controls communication operations of the first communication unit and the second communication unit using the first link and the second link. The control unit controls a transmission frame length in the first link or the second link when the first communication unit starts transmission first on the first link.Type: ApplicationFiled: December 27, 2021Publication date: May 23, 2024Inventors: RYUICHI HIRATA, KEN TANAKA, SHIGERU SUGAYA
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Patent number: 11972611Abstract: A controller is provided that is configured to perform: obtaining information about a condition for an image that is provided to a user, and that corresponds to a preference of the user; specifying at least one predetermined position at which an image satisfying the condition can be taken; and generating a command for a moving object to move to the predetermined position and to take an image, and transmitting the command to the moving object.Type: GrantFiled: June 29, 2021Date of Patent: April 30, 2024Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Satoshi Komamine, Yurika Tanaka, Kenichi Yamada, Ryuichi Kamaga, Ai Miyata, Yu Nagata, Shintaro Matsutani
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Publication number: 20240137974Abstract: A communication device that performs multi-link and multi-user communication is provided. A communication device includes a communication unit capable of wirelessly communicating on a plurality of links, a communication processing unit that performs processing of simultaneously receiving data from a plurality of transmission-side communication devices, and a control unit that performs control to receive data using an optimum link from each of the plurality of transmission-side communication devices. The control unit transmits a trigger request signal for requesting information regarding a transmission opportunity from the plurality of transmission-side communication devices on a link on which a reception opportunity has been acquired, and determines an optimum link for each transmission-side communication device on the basis of a request response signal from the plurality of transmission-side communication devices.Type: ApplicationFiled: December 28, 2021Publication date: April 25, 2024Inventors: SHIGERU SUGAYA, YUSUKE TANAKA, KEN TANAKA, RYUICHI HIRATA
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Publication number: 20240129985Abstract: A communication device that increases transmission efficiency by using a plurality of links is to be provided. A communication device that performs wireless communication using a plurality of links sends, during a period of transmission using a first link, a notification of information regarding a change in the transmission period in the first link, the change being caused by further transmission using a second link. The communication device sends, in the first link, a notification of information indicating whether or not acquisition of a transmission right is being attempted in the second link, and sends, in the second link, a notification of information indicating whether or not at least information regarding a transmission period written in a frame to be transmitted in the first link has been changed, and the information regarding the change in the transmission period in the first link.Type: ApplicationFiled: December 28, 2021Publication date: April 18, 2024Applicant: Sony Group CorporationInventors: Ken TANAKA, Ryuichi HIRATA, Shigeru SUGAYA, Kosuke AIO
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Patent number: 11962413Abstract: The present technology relates to a wireless communication device and method capable of improving reliability of notification regarding a reception result in communication using a plurality of bands. The wireless communication device controls to transmit, by using any band of two or more bands, an MBO BA Setup signal containing setting information regarding a setting of a notification method for a reception result used for communication in the two or more bands, and to transmit a Data signal containing data by using the two or more bands. The present technology can be applied to wireless communication systems.Type: GrantFiled: February 27, 2020Date of Patent: April 16, 2024Assignee: SONY GROUP CORPORATIONInventors: Yusuke Tanaka, Ryuichi Hirata
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Publication number: 20240107582Abstract: A communication device that performs multi-link and multi-user communication is provided. A communication device includes a communication unit capable of wirelessly communicating on a plurality of links, a communication processing unit that performs processing of simultaneously transmitting data to a plurality of reception-side communication devices, and a control unit that performs control to transmit data using an optimum link to each of the plurality of reception-side communication devices. The control unit performs control to transmit a trigger request signal for requesting information regarding a reception opportunity from the plurality of reception-side communication devices on a link on which a transmission opportunity has been acquired, and determine an optimum link for each reception-side communication device on the basis of a request response signal from the plurality of reception-side communication devices.Type: ApplicationFiled: December 28, 2021Publication date: March 28, 2024Applicant: Sony Group CorporationInventors: Shigeru SUGAYA, Yusuke TANAKA, Ken TANAKA, Ryuichi HIRATA
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Publication number: 20220037778Abstract: A flexible wireless communication device with high position accuracy and low cost by a simple process is described, including a wireless communication device and a method for manufacturing a wireless communication device formed by bonding a first film substrate on which at least a circuit is formed and a second film substrate on which an antenna is formed, in which the circuit includes a transistor, and the transistor is formed by a step of forming a conductive pattern on the first film substrate, a step of forming an insulating layer on the film substrate on which the conductive pattern is formed, and a step of applying a solution including an organic semiconductor and/or a carbon material on the insulating layer and drying the solution to form a semiconductor layer.Type: ApplicationFiled: December 13, 2019Publication date: February 3, 2022Applicant: Toray Industries, Inc.Inventors: Ryuichi Tanaka, Seiichiro Murase, Junji Wakita
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Publication number: 20210328011Abstract: A carbon nanotube composite is described that can be accurately applied to a desired position by inkjet and a dispersion liquid using the same, where a main object is a carbon nanotube composite in which a conjugated polymer is attached to at least a part of the surface of a carbon nanotube, the conjugated polymer having a side chain represented by general formula (1): wherein R, X and A are defined as described.Type: ApplicationFiled: September 17, 2019Publication date: October 21, 2021Applicant: Toray Industries, Inc.Inventors: Kazuki Isogai, Seiichiro Murase, Ryuichi Tanaka, Hidekazu Nishino
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Patent number: 8143992Abstract: A multilayer chip varistor is provided as one capable of suppressing production of cracks and thereby preventing a connection failure between an internal electrode and a through-hole conductor. An internal electrode 21 is so configured as to be curved toward a direction of penetration of a through hole 10 in a connection portion 28 thereof to a through-hole conductor 27. By this configuration, a region T sandwiched between a curved surface 28a of the connection portion 28 and the through-hole conductor 27 is formed in a varistor layer 9 near the connection portion 28. In this region T, a metal concentration thereof becomes higher because of diffusion of metal of the internal electrode 21 and the through-hole conductor 27 into the varistor layer 9, and therefore, after completion of firing, the region T has an intermediate contraction percentage between that of the internal electrode 21 and through-hole conductor 27 and that of the other region of the varistor layer 9.Type: GrantFiled: August 4, 2009Date of Patent: March 27, 2012Assignee: TDK CorporationInventors: Hiroyuki Sato, Goro Takeuchi, Osamu Taguchi, Ryuichi Tanaka
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Patent number: 8125307Abstract: An aggregate substrate has a first varistor part, a second varistor part, and a heat dissipation layer. The first varistor part includes a first varistor element layer to exhibit nonlinear voltage-current characteristics, and a plurality of first internal electrodes juxtaposed in the first varistor element layer. The second varistor part includes a second varistor element layer to exhibit nonlinear voltage-current characteristics, and a plurality of second internal electrodes juxtaposed in the second varistor element layer. The heat dissipation layer is located between the first and second varistor parts and is in contact with the first and second varistor parts.Type: GrantFiled: November 21, 2008Date of Patent: February 28, 2012Assignee: TDK CorporationInventors: Hiroyuki Sato, Yo Saito, Ryuichi Tanaka, Makoto Numata, Goro Takeuchi
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Patent number: 7994894Abstract: A varistor having a favorable heat-dissipating property is provided. In the varistor, a composite part having a favorable heat-dissipating property formed by a composite material composed of ZnO and Ag is arranged between main faces of a varistor matrix. Therefore, the heat transmitted from a semiconductor light-emitting device to a varistor part through an outer electrode can rapidly be transferred toward a main face on the opposite side through the composite part. In this varistor, side faces excluding inner side faces are exposed at side faces of the varistor matrix. Such a structure yields a favorable heat-dissipating property.Type: GrantFiled: April 20, 2009Date of Patent: August 9, 2011Assignee: TDK CorporationInventors: Hiroyuki Sato, Makoto Numata, Yo Saito, Hitoshi Tanaka, Goro Takeuchi, Osamu Taguchi, Ryuichi Tanaka
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Patent number: 7932807Abstract: A first varistor section includes a first face of an element body, and a third face facing the first face. The first varistor section has a first varistor element body, a first varistor electrode electrically connected to a first external electrode, and a second varistor electrode electrically connected to a second external electrode. A heat radiation section has a first heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the first and third external electrodes, a second heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the second and fourth external electrodes, and an insulating layer located between the first heat radiation portion and the second heat radiation portion and electrically insulating the first heat radiation portion and the second heat radiation portion from each other. The first heat radiation portion and the second heat radiation portion contain a metal.Type: GrantFiled: March 3, 2009Date of Patent: April 26, 2011Assignee: TDK CorporationInventors: Hiroyuki Sato, Makoto Numata, Yo Saito, Hitoshi Tanaka, Goro Takeuchi, Osamu Taguchi, Ryuichi Tanaka
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Patent number: 7932806Abstract: In a varistor, a heat radiating portion contains the same components as ZnO that is the main component of a varistor element body, as metal oxides, thereby, the structural components of the varistor element body and the heat radiating portion are caused to be common. During firing, Ag contained in the heat radiating portion diffuses into the grain boundaries of ZnO, near the interface between surfaces of the heat radiating portion and the varistor element body. Consequently, in the varistor, cracks hardly occur between the varistor portion and the heat radiating portion during firing (or during binder removal), thereby, ensuring sufficient bonding strength between the varistor portion and the heat radiating portion. Therefore, heat conducted to the varistor portion is radiated efficiently conducting through electrically conducted paths formed in the heat radiating portion from the surface facing the varistor element body to other three surfaces of the heat radiating portion.Type: GrantFiled: March 26, 2008Date of Patent: April 26, 2011Assignee: TDK CorporationInventors: Hiroyuki Sato, Yo Saito, Ryuichi Tanaka, Makoto Numata, Goro Takeuchi
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Patent number: 7911317Abstract: A multilayer chip varistor is provided as one having excellent heat radiation performance. A thickness between a first principal face 3 and an outermost internal electrode layer 11A is smaller than a thickness between an internal electrode layer 21 and the outermost internal electrode layer 11A, and because of this configuration, heat generated from a bottom face of a semiconductor light emitting device LE1 is efficiently transferred to the outermost internal electrode layer 11A having a high thermal conductivity. Furthermore, in the multilayer chip varistor V1 of an electronic component EC1, the outermost internal electrode layer 11A has a first internal electrode 13 electrically connected to a first connection electrode 7 and a first terminal electrode 5 through first through-hole conductors 17, and a second internal electrode 15 electrically connected to a second connection electrode 8 and a second terminal electrode 6 through second through-hole conductors 27.Type: GrantFiled: August 6, 2009Date of Patent: March 22, 2011Assignee: TDK CorporationInventors: Ryuichi Tanaka, Goro Takeuchi, Hiroyuki Sato, Osamu Taguchi
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Publication number: 20100117782Abstract: A varistor having a favorable heat-dissipating property is provided. In the varistor, a composite part having a favorable heat-dissipating property formed by a composite material composed of ZnO and Ag is arranged between main faces of a varistor matrix. Therefore, the heat transmitted from a semiconductor light-emitting device to a varistor part through an outer electrode can rapidly be transferred toward a main face on the opposite side through the composite part. In this varistor, side faces excluding inner side faces are exposed at side faces of the varistor matrix. Such a structure yields a favorable heat-dissipating property.Type: ApplicationFiled: April 20, 2009Publication date: May 13, 2010Applicant: TDK CORPORATIONInventors: Hiroyuki SATO, Makoto NUMATA, Yo SAITO, Hitoshi TANAKA, Goro TAKEUCHI, Osamu TAGUCHI, Ryuichi TANAKA
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Publication number: 20100066479Abstract: A multilayer chip varistor is provided as one having excellent heat radiation performance. A thickness between a first principal face 3 and an outermost internal electrode layer 11A is smaller than a thickness between an internal electrode layer 21 and the outermost internal electrode layer 11A, and because of this configuration, heat generated from a bottom face of a semiconductor light emitting device LE1 is efficiently transferred to the outermost internal electrode layer 11A having a high thermal conductivity. Furthermore, in the multilayer chip varistor V1 of an electronic component EC1, the outermost internal electrode layer 11A has a first internal electrode 13 electrically connected to a first connection electrode 7 and a first terminal electrode 5 through first through-hole conductors 17, and a second internal electrode 15 electrically connected to a second connection electrode 8 and a second terminal electrode 6 through second through-hole conductors 27.Type: ApplicationFiled: August 6, 2009Publication date: March 18, 2010Applicant: TDK CORPORATIONInventors: Ryuichi TANAKA, Goro TAKEUCHI, Hiroyuki SATO, Osamu TAGUCHI
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Publication number: 20100052841Abstract: A multilayer chip varistor is provided as one capable of suppressing production of cracks and thereby preventing a connection failure between an internal electrode and a through-hole conductor. An internal electrode 21 is so configured as to be curved toward a direction of penetration of a through hole 10 in a connection portion 28 thereof to a through-hole conductor 27. By this configuration, a region T sandwiched between a curved surface 28a of the connection portion 28 and the through-hole conductor 27 is formed in a varistor layer 9 near the connection portion 28. In this region T, a metal concentration thereof becomes higher because of diffusion of metal of the internal electrode 21 and the through-hole conductor 27 into the varistor layer 9, and therefore, after completion of firing, the region T has an intermediate contraction percentage between that of the internal electrode 21 and through-hole conductor 27 and that of the other region of the varistor layer 9.Type: ApplicationFiled: August 4, 2009Publication date: March 4, 2010Applicant: TDK CORPORATIONInventors: Hiroyuki SATO, Goro TAKEUCHI, Osamu TAGUCHI, Ryuichi TANAKA
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Publication number: 20090243768Abstract: A first varistor section includes a first face of an element body, and a third face facing the first face. The first varistor section has a first varistor element body, a first varistor electrode electrically connected to a first external electrode, and a second varistor electrode electrically connected to a second external electrode. A heat radiation section has a first heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the first and third external electrodes, a second heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the second and fourth external electrodes, and an insulating layer located between the first heat radiation portion and the second heat radiation portion and electrically insulating the first heat radiation portion and the second heat radiation portion from each other. The first heat radiation portion and the second heat radiation portion contain a metal.Type: ApplicationFiled: March 3, 2009Publication date: October 1, 2009Applicant: TDK CORPORATIONInventors: Hiroyuki Sato, Makoto Numata, Yo Saito, Hitoshi Tanaka, Goro Takeuchi, Osamu Taguchi, Ryuichi Tanaka