Abstract: An object of the present invention is to prevent a semiconductor substrate from being damaged when the substrate is conveyed by a conveying robot provided in a semiconductor manufacturing apparatus. A diffusion furnace apparatus has a diffusion furnace that processes a semiconductor wafer, a quartz boat that is arranged in the diffusion furnace to store the semiconductor wafer, and a conveying robot that delivers the semiconductor wafer between the quartz boat and a cassette carried in from the outside. Further, the conveying robot includes a column-like sensor support unit provided at a part that is not turned, and a first sensor that detects the presence or absence of the semiconductor wafer held on a plate of the conveying robot and a second sensor that detects the positional displacement of the semiconductor wafer held on the plate are provided at the sensor support unit.

Abstract: An object of the present invention is to prevent a semiconductor substrate from being damaged when the substrate is conveyed by a conveying robot provided in a semiconductor manufacturing apparatus. A diffusion furnace apparatus has a diffusion furnace that processes a semiconductor wafer, a quartz boat that is arranged in the diffusion furnace to store the semiconductor wafer, and a conveying robot that delivers the semiconductor wafer between the quartz boat and a cassette carried in from the outside. Further, the conveying robot includes a column-like sensor support unit provided at a part that is not turned, and a first sensor that detects the presence or absence of the semiconductor wafer held on a plate of the conveying robot and a second sensor that detects the positional displacement of the semiconductor wafer held on the plate are provided at the sensor support unit.