Abstract: A metal foil pattern layered body of the invention includes a base member; a metal foil including a metal pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: A metal foil pattern layered body of the invention includes: a base member; a metal foil including a metal foil pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

Abstract: A metal foil pattern layered body of the invention includes a base member; a metal foil including a metal pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: Short circuit failures and open circuit failures of light-emitting elements used for the backlight in an LCD panel can be reliably and easily detected. The voltage at the node between each series-connected light-emitting element array and a drive circuit is detected as a monitored voltage. A maximum detector detects the highest and a minimum detector detects the lowest of these monitored voltages. Short circuit or open circuit failure of a light-emitting element is detected by comparing the voltage difference between the maximum detector output and the minimum detector output with a specific reference voltage.

Abstract: Short circuit failures and open circuit failures of light-emitting elements used for the backlight in an LCD panel can be reliably and easily detected. The voltage at the node between each series-connected light-emitting element array and a drive circuit is detected as a monitored voltage. A maximum detector detects the highest and a minimum detector detects the lowest of these monitored voltages. Short circuit or open circuit failure of a light-emitting element is detected by comparing the voltage difference between the maximum detector output and the minimum detector output with a specific reference voltage.

Abstract: Short circuit failures and open circuit failures of light-emitting elements used for the backlight in an LCD panel can be reliably and easily detected. The voltage at the node between each series-connected light-emitting element array and a drive circuit is detected as a monitored voltage. A maximum detector detects the highest and a minimum detector detects the lowest of these monitored voltages. Short circuit or open circuit failure of a light-emitting element is detected by comparing the voltage difference between the maximum detector output and the minimum detector output with a specific reference voltage.

Abstract: A metal foil pattern layered body of the invention includes: a base member; a metal foil including a metal foil pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: The load driving apparatus according to the present invention includes a load current setting signal generating section, a load current generating section, a reference voltage generating section and a drive voltage generating section. The load current setting signal generating section generates a desired load current setting signal. The load current generating section generates a load current based on the load current setting signal to drive the load. The reference voltage generating section generates a reference voltage based on the load current setting signal. The drive voltage generating section generates a drive voltage, supplies the drive voltage to the load, generates a between-both-terminals voltage between both terminals of the load current generating section based on the drive voltage and controls the drive voltage so that the difference between the between-both-terminals voltage and the reference voltage becomes small.

Abstract: Short circuit failures and open circuit failures of light-emitting elements used for the backlight in an LCD panel can be reliably and easily detected. The voltage at the node between each series-connected light-emitting element array and a drive circuit is detected as a monitored voltage. A maximum detector detects the highest and a minimum detector detects the lowest of these monitored voltages. Short circuit or open circuit failure of a light-emitting element is detected by comparing the voltage difference between the maximum detector output and the minimum detector output with a specific reference voltage.

Abstract: A metal photoetching product comprising at least one large cavity of minor axis W1S, major axis W1L and depth D1 in a surface of the product, wherein one or more cavities are included inside at least one of the at least one large cavity, and a smallest hole among the cavities has minor axis of W2S, major axis W2L, and depth D2; and the product satisfies the following dimensions, D1+D2=plate thickness D, 0.02 mm?D?2 mm, 0.4×D<W1S<D, and 0.2×D<W2S<0.8×D.

Abstract: A backlight drive apparatus for current driving a plurality of strings has a period in which at least one of the strings is a current driven idly during a liquid crystal OFF period, in addition to a current driving period in which video information is displayed via liquid crystals. A failure detection section can monitor stabilized detection voltages in the period when current driven idly and detects failure state of the backlight panel.

Abstract: The load driving apparatus according to the present invention includes a load current setting signal generating section, a load current generating section, a reference voltage generating section and a drive voltage generating section. The load current setting signal generating section generates a desired load current setting signal. The load current generating section generates a load current based on the load current setting signal to drive the load. The reference voltage generating section generates a reference voltage based on the load current setting signal. The drive voltage generating section generates a drive voltage, supplies the drive voltage to the load, generates a between-both-terminals voltage between both terminals of the load current generating section based on the drive voltage and controls the drive voltage so that the difference between the between-both-terminals voltage and the reference voltage becomes small.

Abstract: The N light emitting element groups each include one or more light emitting elements. The power source circuit includes a control input terminal and supplies the power source voltage to the N light emitting element groups. The N current driving circuits, each including a feedback output terminal, generate N drive currents for driving the respective N light emitting element groups and generate main feedback voltages at the feedback output terminals based on the power source voltage. The main feedback circuit applies a main feedback signal to the control input terminal based on the N main feedback voltages. The auxiliary feedback circuit applies an auxiliary feedback signal to the control input terminal based on the power source voltage. The power source circuit adjusts the power source voltage based on at least one of the main feedback signal and the auxiliary feedback signal.

Abstract: A metal photoetching product comprising at least one large cavity of minor axis W1S, major axis W1L and depth D1 in a surface of the product, wherein one or more cavities are included inside at least one of the at least one large cavity, and a smallest hole among the cavities has minor axis of W2S, major axis W2L, and depth D2; and the product satisfies the following dimensions, D1+D2=plate thickness D, 0.02 mm?D?2 mm, 0.4×D<W1S<D, and 0.2×D<W2S<0.8×D.

Abstract: A metal photoetching product comprising at least one large cavity of minor axis W1S, major axis W1L and depth D1 in a surface of the product, wherein one or more cavities are included inside at least one of the at least one large cavity, and a smallest hole among the cavities has minor axis of W2S, major axis W2L, and depth D2; and the product satisfies the following dimensions, D1+D2=plate thickness D, 0.02 mm?D?2 mm, 0.4×D<W1S<D, and 0.2×D<W2S<0.8×D.