Patents by Inventor Ryunosuke HANDA

Ryunosuke HANDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compound For Forming Metal-Containing Film, Composition For Forming Metal-Containing Film, Patterning Process, And Semiconductor Photoresist Material
    Publication number: 20240116958
    Abstract: A compound for forming a metal-containing film to be contained in a composition for forming a metal-containing film used in manufacturing a semiconductor, where the compound for forming a metal-containing film is represented by the following general formula (M-1) or (M-2). This provides: a compound for forming a metal-containing film having better dry etching resistance than conventional resist underlayer film materials and also having high filling and planarizing properties; a composition for forming a metal-containing film containing the compound; a patterning process in which the composition is used as a resist underlayer film material; a patterning process in which the composition is used as a resist material; and a semiconductor photoresist material containing the composition.
    Type: Application
    Filed: September 6, 2023
    Publication date: April 11, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoki KOBAYASHI, Shohei IWAMORI, Daisuke KORI, Shun KIKUCHI, Ryunosuke HANDA, Seiichiro TACHIBANA