Patents by Inventor Ryuzo Houchin

Ryuzo Houchin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for forming thin film
    Patent number: 5863338
    Abstract: A forming apparatus of a thin film, includes a processing chamber where a predetermined process is carried out on a surface of a supplied substrate, and a feeding device, which is provided in the processing chamber, for feeding material to form an organic molecular layer including silicon or germanium on the surface of the substrate. A forming method of a thin film, includes steps of forming a thin film on a surface of a supplied substrate in a processing chamber, and feeding material for forming an organic molecular layer including silicon or germanium on the formed thin film on the surface of the substrate through a feeding device in the processing chamber, and then forming the organic molecular layer on the surface of the substrate.
    Type: Grant
    Filed: January 5, 1996
    Date of Patent: January 26, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yuichiro Yamada, Naoki Suzuki, Ryuzo Houchin, Noboru Nomura, Kousaku Yano, Yuka Terai
  • Apparatus and method for forming thin film
    Patent number: 5501739
    Abstract: A forming apparatus of a thin film includes a processing chamber where a predetermined process is carried out on a surface of a supplied substrate. A feeding device is provided in the processing chamber for feeding material to form an organic molecular layer including silicon or germanium on the surface of the substrate. A forming method of a thin film includes the steps of forming the thin film on the surface of the supplied substrate in the processing chamber, and feeding material for forming the organic molecular layer, including silicon or germanium, on the formed thin film on the surface of the substrate through a feeding device in the processing chamber, and then forming the organic molecular layer on the surface of the substrate.
    Type: Grant
    Filed: November 29, 1993
    Date of Patent: March 26, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yuichiro Yamada, Naoki Suzuki, Ryuzo Houchin, Noboru Nomura, Kousaku Yano, Yuka Terai