Patents by Inventor Sébastien S. Quesnel

Sébastien S. Quesnel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip-chip bonder with induction coils and a heating element
    Patent number: 9875985
    Abstract: A method and apparatus for flip chip bonding using conductive and inductive heating to heat a plurality of solder bumps located between a chip carrier and a chip.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: January 23, 2018
    Assignee: International Business Machines Corporation
    Inventors: Jae-woong Nah, Sébastien S. Quesnel, Katsuyuki Sakuma
  • FLIP-CHIP BONDER WITH INDUCTION COILS
    Publication number: 20160141264
    Abstract: A method and apparatus for flip chip bonding using conductive and inductive heating to heat a plurality of solder bumps located between a chip carrier and a chip.
    Type: Application
    Filed: November 18, 2014
    Publication date: May 19, 2016
    Inventors: Jae-woong Nah, Sébastien S. Quesnel, Katsuyuki Sakuma
  • Solder bump reflow by induction heating
    Patent number: 9190375
    Abstract: A method of applying inductive heating to join an integrated circuit chip to an electrical substrate using solder bumps including applying a magnetic field to a magnetic liner in thermal contact with a solder bump on the integrated circuit chip. The magnetic field causes Joule heating in the magnetic liner sufficient to melt the solder bump, which has a lower portion embedded in a first dielectric layer and an upper portion at least partially embedded in a second dielectric layer. The lower portion is in electrical contact with a conductive pad, the first dielectric layer is above the conductive pad and the second dielectric layer is on top of the first dielectric layer. The duration of application of the magnetic field is controlled to achieve a joining temperature that is approximately halfway between the storage and operating temperatures of the integrated circuit chip.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: November 17, 2015
    Assignee: GlobalFoundries, Inc.
    Inventors: Stephen P. Ayotte, Sebastien S. Quesnel, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan
  • SOLDER BUMP REFLOW BY INDUCTION HEATING
    Publication number: 20150294948
    Abstract: A method of applying inductive heating to join an integrated circuit chip to an electrical substrate using solder bumps including applying a magnetic field to a magnetic liner in thermal contact with a solder bump on the integrated circuit chip, the magnetic field causes Joule heating in the magnetic liner sufficient to melt the solder bump, the solder bump comprising a lower portion embedded in a first dielectric layer and an upper portion at least partially embedded in a second dielectric layer, the lower
    Type: Application
    Filed: April 9, 2014
    Publication date: October 15, 2015
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen P. Ayotte, Sebastien S. Quesnel, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan