Abstract: The main purpose of this invention is to improve high forming pressure of existing Fe—Si—Al insulating magnetic powder which is not suitable for forming, combine heterogeneous insulating magnetic powder, produce hollow cup-like cover and Fe—Si—Al rod core for full magnetic path component assembling, and change the shape structure of rod core and cover design, so there will be advantages including easy to winding, assemble and cooling.

Abstract: The technology of this invention is to combine the advantage of cold and hot forming magnetic component. Use the advantage of hot forming technology which is 3D complex forming, and use hot-forming magnetic powder to form magnetic component body. Single or multiple rod spaces including T shape, “I” shape or rod shape are previously reserved, and advantage of cold forming technology is used to produce core rod in the highest density of magnetic line, in order to provide the source of high induction magnetic line. Next, assemble single or multiple core rods with body, in order to obtain assembling magnetic component of final desiring magnetic induction.

Abstract: The invention relates to a hot-forming magnetic component composed of core, assembled coil, and magnetic glue. It can make no air gap between the core of magnetic component and magnetic shielding material, avoid gap loss, reduce equipments or molds wear, and enhance the magnetic paths and permeability.

Abstract: A hot-forming fabrication method of a magnetic component and a hot-formed magnetic component fabricated by the same are provided. More particularly, a magnetic powder hot-forming technique is provided, along with a hot-formed magnetic component fabricated by the hot-forming technique so as to have high inductance, low core loss, and high electromagnetic wave shielding efficiency. A low core low-core loss core for use in a common basic magnetic component is enclosed and thereby shielded by a single-layer or multi-layer EMI shielding material, thus producing an enhanced magnetic component with high inductance, low core loss, and low electromagnetic wave interference.