Patents by Inventor Sa Huang

Sa Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-destructive tilt data measurement to detect defective bumps
    Patent number: 8860456
    Abstract: The present disclosure includes techniques and apparatus for making non-contact differential measurements of various dimensions of electronic components surface mounted on circuit boards. Tilt data relating to the electronic components is derived from the differential measurements to provide an indication of the integrity of the electrical connection between the electronic components to the circuit board. The techniques and apparatus of the present disclosure make it possible to accomplish non-destructive inspection of the connection without individually inspecting each bump-terminal connection.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: October 14, 2014
    Assignee: Medtronic, Inc.
    Inventors: Sa Huang, Mark E. Henschel
  • Electrical Connecting Element and Method for Manufacturing the Same
    Publication number: 20140217593
    Abstract: An electrical connecting element for connecting a first substrate and a second substrate and a method for manufacturing the same are disclosed. The method of the present invention comprises: (A) providing a first substrate and a second substrate, wherein a first copper film is formed on the first substrate, a first metal film is formed on the second substrate, a first connecting surface of the first copper film has a (111)-containing surface, and the first metal film has a second connecting surface; and (B) connecting the first copper film and the first metal film to form an interconnect, wherein the first connecting surface of the first copper film is faced to the second connecting surface of the first metal film.
    Type: Application
    Filed: February 6, 2014
    Publication date: August 7, 2014
    Applicant: National Chiao Tung University
    Inventors: Chih CHEN, Taochi LIU, Yi-Sa HUANG, Chien-Min LIU
  • Non-Destructive Tilt Data Measurement to Detect Defective Bumps
    Publication number: 20130033286
    Abstract: The present disclosure includes techniques and apparatus for making non-contact differential measurements of various dimensions of electronic components surface mounted on circuit boards. Tilt data relating to the electronic components is derived from the differential measurements to provide an indication of the integrity of the electrical connection between the electronic components to the circuit board. The techniques and apparatus of the present disclosure make it possible to accomplish non-destructive inspection of the connection without individually inspecting each bump-terminal connection.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventors: Sa Huang, Mark E. Henschel