Abstract: Packaged integrated circuits and methods to form a packaged integrated circuit are disclosed. A disclosed method comprises attaching an integrated circuit to a substrate, coupling a first end of a bond wire directly to the substrate without an intervening bonding pad and a second end of the bond wire to a contact of the integrated circuit, encapsulating the integrated circuit and the bond wire, and removing the substrate to expose the first end of the bond wire.

Abstract: A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second heat slug is attached to the second surface of the semiconductor chip through the substrate opening.

Abstract: A system for manufacturing electronic device packages includes a conveyor with an adhesive work surface to support a predetermined array of external connectors for flip-chip bonding of dies thereto. After assembly, the dies with associated external connectors bonded thereto are encapsulated on a work surface of the conveyor whereby the work surface forms at least part of an inner surface of an encapsulating mold.

Abstract: A semiconductor component includes a semiconductor chip (120, 1120), an electrically conductive adhesive located over the semiconductor chip, and a clip bond (231, 232, 1231, 1232) located over the electrically conductive adhesive. The clip bond has at least one burr to retain the electrically conductive adhesive.

Abstract: A method of manufacturing a semiconductor component includes coupling a clip bond (230) from a semiconductor chip (120) to a lead frame (110) and dividing the clip bond into at least first and second portions separated from each other.

Abstract: A method of forming a semiconductor package (30) on a leadframe (20) trimmed from strip (10). Encapsulant (34) forms plastic tie bars (40) linking the semiconductor package (30) and the strip (10), to mechanically support, but electrically isolate, the semiconductor die (31) for functionality testing.

Abstract: A method of manufacturing a semiconductor component includes coupling a clip bond (230) from a semiconductor chip (120) to a lead frame (110) and dividing the clip bond into at least first and second portions separated from each other.

Abstract: A semiconductor component includes a semiconductor chip (120, 1120), an electrically conductive adhesive located over the semiconductor chip, and a clip bond (231, 232, 1231, 1232) located over the electrically conductive adhesive. The clip bond has at least one burr to retain the electrically conductive adhesive.

Abstract: A semiconductor package (8) with a die (10) having die pads (16) coupled to inner ends (22) of interconnects (20), the die (10) and the interconnects (20) are molded in mold compound (30) with mounting surface (12) and outer ends (24) exposed. A semiconductor die has an interconnect surface opposite the mounting surface.

Abstract: In order to package an electronic component, a leadframe is provided having at least one flag portion (2) and at least one lead portion (7) extending towards the flag portion (2). The lead portion (7) includes an end portion (10) of reduced thickness adjacent the flag portion (2) and a channel (9) between the end portion (10) and the rest of the lead portion. The leadframe is etched to form the channel (9) and the end portion(10), which together form a locking step. The electronic component (3) is then mounted on the flag portion (2) and electrically connected to the end of the lead portion (7). The electronic component (3), the electrical connection (5), at least the end portion (10) and the intermediate portion (9) of the lead portion (7) and at least part of the flag portion (2) are encapsulated in a plastics molding compound, which enters and fills the locking step, and is then cured.