Patents by Inventor Saburo Okabe

Saburo Okabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free solder, and a lead-free joint
    Patent number: 7220493
    Abstract: A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: May 22, 2007
    Assignees: Koa Kabushiki Kaisha, Soldercoat Co., Ltd., Okabe Giken Co., Ltd.
    Inventors: Satoru Kobayashi, Kazuyuki Kato, Masahiro Sugiura, Saburo Okabe
  • Lead-free solder, and a lead-free joint
    Publication number: 20060104854
    Abstract: A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.
    Type: Application
    Filed: October 23, 2003
    Publication date: May 18, 2006
    Applicants: Koa Kabushiki Kaisha, Soldercoat Co., Ltd., Okabe Giken Co., Ltd.
    Inventors: Satoru Kobayashi, Kazuyuki Kato, Masahiro Sugiura, Saburo Okabe