Patents by Inventor Sachin Bedare

Sachin Bedare has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11551891
    Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: January 10, 2023
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Raghavendra Doddi, Prasanna Pichumani, Sachin Bedare, Bijendra Singh, Gopinath Kandasamy
  • Publication number: 20220376623
    Abstract: A computing system having a high-performance battery pack (e.g., 3S, 4S battery packs) coupled to a voltage regulator and logic to control an input supply of the voltage regulator. The logic determines the context of usage of the computing device (or user attentiveness) and either dynamically bypasses the voltage regulator to provide the voltage from the high-performance battery pack directly to various components of the computing system, or dynamically engages devices of the voltage regulator to provide a lower supply voltage to the various components of the computing system.
    Type: Application
    Filed: May 18, 2021
    Publication date: November 24, 2022
    Applicant: Intel Corporation
    Inventors: Jagadish Singh, Tarakesava Reddy Koki, Mallari C. Hanchate, Anoop Parchuru, Praveen Kashyap Ananta Bhat, Don J. Nguyen, Sachin Bedare, Raghavendra R. Rao, Vinaya Kumar Chandrasekhara, Govindaraj G.
  • Publication number: 20220015273
    Abstract: An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.
    Type: Application
    Filed: September 23, 2021
    Publication date: January 13, 2022
    Inventors: Bala P. Subramanya, Prakash Kurma Raju, Navneet K. Singh, Sachin Bedare, Vijith Halestoph R.
  • Patent number: 11044548
    Abstract: In one embodiment, a portable computing device is described. The portable computing device includes a first surface comprising at least one user interface. The portable computing device also includes a second surface opposite the first surface. Further, the portable computing device includes at least one speaker port in the first surface. Further yet, the portable computing device includes a collapsible speaker chamber configured on the second surface opposite the at least one speaker port. Moreover, the portable computing device includes a speaker configured in the portable computing device between the speaker port and the collapsible speaker chamber.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: June 22, 2021
    Assignee: Intel Corporation
    Inventors: Samarth Alva, Sumod Cherukkate, Sachin Bedare
  • Publication number: 20200322714
    Abstract: In one embodiment, a portable computing device is described. The portable computing device includes a first surface comprising at least one user interface. The portable computing device also includes a second surface opposite the first surface. Further, the portable computing device includes at least one speaker port in the first surface. Further yet, the portable computing device includes a collapsible speaker chamber configured on the second surface opposite the at least one speaker port. Moreover, the portable computing device includes a speaker configured in the portable computing device between the speaker port and the collapsible speaker chamber.
    Type: Application
    Filed: December 26, 2019
    Publication date: October 8, 2020
    Inventors: Samarth Alva, Sumod Cherukkate, Sachin Bedare
  • Patent number: 10732683
    Abstract: In some embodiments, power may be temporarily removed from a first portion of a computer system (such as a display), and that power redirected to a second portion (such as a processor or System on a Chip), so that extra performance may be obtained from the second portion without exceeding the power budget for the system. If the first portion is a display, the time period of removed power may be short enough that the absence of luminance during that time period will not be noticeable to the human vision system. In a similar embodiment, power may be delivered to the first portion using pulse width modulation, using the time between pulses to redirect power to the other portion.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: August 4, 2020
    Assignee: Intel Corporation
    Inventors: Sachin Bedare, Mallari Hanchate, Praveen Kashyap Ananta Bhat, Govindaraj Gettimalli, Vijayakumar A. Dibbad
  • Publication number: 20190326081
    Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.
    Type: Application
    Filed: June 27, 2019
    Publication date: October 24, 2019
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Raghavendra Doddi, Prasanna Pichumani, Sachin Bedare, Bijendra Singh, Gopinath Kandasamy
  • Patent number: 10403560
    Abstract: Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 3, 2019
    Assignee: Intel Corporation
    Inventors: Bijendra Singh, Sachin Bedare
  • Patent number: 10275016
    Abstract: Disclosed are electrical systems and electronic devices. An electrical system includes an electronic device. The electronic device is configured to receive external power from an external power source, the external power sufficient to support normal mode operation of the electronic device. The electronic device includes control circuitry programmed to operate in the normal mode while receiving external power, and transition to one of a low power mode and a pre-shutdown mode responsive to sensor inputs. An electronic device includes an internal power source configured to provide internal power sufficient to support low power requirements of the electronic device operating in a low power mode, but not sufficient to support normal power requirements of a normal mode. The electronic device includes control circuitry programmed to transition from the low power mode to a hibernate mode while powered by only the internal power source.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: April 30, 2019
    Assignee: INTEL CORPORATION
    Inventors: Sachin Bedare, Ayeshwarya Mahajan
  • Publication number: 20190045665
    Abstract: Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.
    Type: Application
    Filed: September 28, 2018
    Publication date: February 7, 2019
    Applicant: Intel Corporation
    Inventors: Bijendra Singh, Sachin Bedare
  • Publication number: 20190041931
    Abstract: In some embodiments, power may be temporarily removed from a first portion of a computer system (such as a display), and that power redirected to a second portion (such as a processor or System on a Chip), so that extra performance may be obtained from the second portion without exceeding the power budget for the system. If the first portion is a display, the time period of removed power may be short enough that the absence of luminance during that time period will not be noticeable to the human vision system. In a similar embodiment, power may be delivered to the first portion using pulse width modulation, using the time between pulses to redirect power to the other portion.
    Type: Application
    Filed: April 30, 2018
    Publication date: February 7, 2019
    Applicant: Intel Corporation
    Inventors: Sachin Bedare, Mallari Hanchate, Praveen Kashyap Ananta Bhat, Govindaraj Gettimalli, Vijayakumar A. Dibbad
  • Publication number: 20170177069
    Abstract: Disclosed are electrical systems and electronic devices. An electrical system includes an electronic device. The electronic device is configured to receive external power from an external power source, the external power sufficient to support normal mode operation of the electronic device. The electronic device includes control circuitry programmed to operate in the normal mode while receiving external power, and transition to one of a low power mode and a pre-shutdown mode responsive to sensor inputs. An electronic device includes an internal power source configured to provide internal power sufficient to support low power requirements of the electronic device operating in a low power mode, but not sufficient to support normal power requirements of a normal mode. The electronic device includes control circuitry programmed to transition from the low power mode to a hibernate mode while powered by only the internal power source.
    Type: Application
    Filed: December 21, 2015
    Publication date: June 22, 2017
    Applicant: INTEL CORPORATION
    Inventors: Sachin Bedare, Ayeshwarya Mahajan