Patents by Inventor Sachio Igarashi

Sachio Igarashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7364796
    Abstract: Adhesive composition and a flexible packaging composite film that can produce a reduced amount of low-molecular-weight compounds eluted into contents of a composite film to prevent spoilage of inherent properties or performances of the contents, can produce improved oil resistance to prevent significant reduction in strength even when used for oily contents, and can develop favorable flexibility of the composite film to prevent reduction in peel strength. Polyester polyamide polyol and/or polyurethane polyester polyamide polyol including an amide bond produced by reaction between a dimer acid and polyamine is prepared as a polyol component and also concentration of a cyclic compound formed by the amide bond and/or an ester bond in extracted water which is extracted from a composite film adhesively bonded by the adhesive composition by water of 0.5 mL/cm2 per unit area of the composite film is set to be 0.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: April 29, 2008
    Assignee: Mitsui Takeda Chemicals, Inc.
    Inventors: Shigetoshi Sasano, Sachio Igarashi
  • Publication number: 20050272898
    Abstract: Adhesive composition and a flexible packaging composite film that can produce a reduced amount of low-molecular-weight compounds eluted into contents of a composite film to prevent spoilage of inherent properties or performances of the contents, can produce improved oil resistance to prevent significant reduction in strength even when used for oily contents, and can develop favorable flexibility of the composite film to prevent reduction in peel strength. Polyester polyamide polyol and/or polyurethane polyester polyamide polyol including an amide bond produced by reaction between a dimer acid and polyamine is prepared as a polyol component and also concentration of a cyclic compound formed by the amide bond and/or an ester bond in extracted water which is extracted from a composite film adhesively bonded by the adhesive composition by water of 0.5 mL/cm2 per unit area of the composite film is set to be 0.
    Type: Application
    Filed: July 22, 2003
    Publication date: December 8, 2005
    Applicant: MITSUI TAKEDA CHEMICALS, INC.
    Inventors: Shigetoshi Sasano, Sachio Igarashi
  • Patent number: 6908981
    Abstract: A laminate adhesive that can suppress elution of a low molecular weight compounds of a composite film into the content, so as to prevent the inherent properties or performances of the content from being spoiled by the low molecular weight compounds. In the laminate adhesive, the polyester polyol contains naphthalenedicarboxylic acid and/or alkyl ester thereof as an acid component, and concentration of cyclic ester compounds in extracted water, which are extracted from a composite film bonded by the laminate adhesive by water of 0.5 mL/cm2 per unit area of the composite film, is 0.5 ppb or less in terms of dibutyl phthalate concentration measured by a gas chromatograph-flame ionization detector.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: June 21, 2005
    Assignee: Mitsui Takeda Chemicals, Inc.
    Inventors: Shigetoshi Sasano, Sachio Igarashi
  • Patent number: 6846894
    Abstract: To provide a laminate adhesive that can keep on having adequate adhesiveness and also can prevent the odor and taste of the inherent properties of the content packed by the packing product from being spoiled even after high temperature sterilization treatment, such as the hot-water spray sterilization treatment, the hot-water rotary sterilization treatment or the steam sterilization treatment, to provide a usage of the laminate adhesive, the laminate adhesive comprises a curing component containing polyisocyanate and a base component containing polyol, wherein a silane coupling agent is contained in at least the curing component. Preferably, the silane coupling agent is mixed with both of the curing component and the base component. Further preferably, epoxysilane is mixed with the curing component and also aminosilane and oxyacid of phosphorus or derivative thereof are mixed with the base component.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: January 25, 2005
    Assignee: Mitsui Takeda Chemicals, Inc.
    Inventors: Hideki Terada, Shigetoshi Sasano, Sachio Igarashi
  • Publication number: 20030096110
    Abstract: To provide a laminate adhesive that can keep on having adequate adhesiveness and also can prevent the odor and taste of the inherent properties of the content packed by the packing product from being spoiled even after high temperature sterilization treatment, such as the hot-water spray sterilization treatment, the hot-water rotary sterilization treatment or the steam sterilization treatment, to provide a usage of the laminate adhesive, the laminate adhesive comprises a curing component containing polyisocyanate and a base component containing polyol, wherein a silane coupling agent is contained in at least the curing component. Preferably, the silane coupling agent is mixed with both of the curing component and the base component. Further preferably, epoxysilane is mixed with the curing component and also aminosilane and oxyacid of phosphorus or derivative thereof are mixed with the base component.
    Type: Application
    Filed: July 22, 2002
    Publication date: May 22, 2003
    Inventors: Hideki Terada, Shigetoshi Sasano, Sachio Igarashi
  • Patent number: 6538095
    Abstract: The solvent-free two-component adhesive composition of the present invention comprises a polyol component (A) and a polyisocyanate component (B), and the viscosity of the mixture at 80° C. immediately after the point of time the components (A) and (B) are mixed together is 900 mPa·s or higher. The component (A) may be a polyol having a number average molecular weight of 800 or larger, or a mixture thereof, and the viscosity of the component (B) at 25° C. may be 20,000 mPa·s or higher. The composition may be used for laminating metal foil of 5 to 15 m thickness with a plastic film. By using the composition of the present invention, the occurrence of blocking due to the seepage of the adhesive from metal foil is prevented. The present invention includes a process of lamination using the same.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: March 25, 2003
    Assignee: Mitsui Takada Chemicals Inc.
    Inventors: Akihiro Imai, Taiji Morimoto, Sachio Igarashi
  • Publication number: 20020143102
    Abstract: A laminate adhesive that can suppress elution of a low molecular weight compounds of a composite film into the content, so as to prevent the inherent properties or performances of the content from being spoiled by the low molecular weight compounds. In the laminate adhesive, the polyester polyol contains naphthalenedicarboxylic acid and/or alkyl ester thereof as an acid component, and concentration of cyclic ester compounds in extracted water, which are extracted from a composite film bonded by the laminate adhesive by water of 0.5 mL/cm2 per unit area of the composite film, is 0.5 ppb or less in terms of dibutyl phthalate concentration measured by a gas chromatograph-flame ionization detector.
    Type: Application
    Filed: January 28, 2002
    Publication date: October 3, 2002
    Inventors: Shigetoshi Sasano, Sachio Igarashi
  • Publication number: 20020143133
    Abstract: The solvent-free two-component adhesive composition of the present invention comprises a polyol component (A) and a polyisocyanate component (B), and the viscosity of the mixture at 80° C. immediately after the point of time the components (A) and (B) are mixed together is 900 mPa·s or higher. The component (A) may be a polyol having a number average molecular weight of 800 or larger, or a mixture thereof, and the viscosity of the component (B) at 25° C. may be 20,000 mPa·s or higher. The composition may be used for laminating metal foil of 5 to 15 m thickness with a plastic film. By using the composition of the present invention, the occurrence of blocking due to the seepage of the adhesive from metal foil is prevented. The present invention includes a process of lamination using the same.
    Type: Application
    Filed: March 29, 2002
    Publication date: October 3, 2002
    Inventors: Akihiro Imai, Taiji Morimoto, Sachio Igarashi
  • Patent number: 6288201
    Abstract: A laminate adhesive that can suppress elusion of a low molecular weight compounds of a composite film into the content, so as to prevent the inherent properties or performances of the content from being spoiled by the low molecular weight compounds. The laminate adhesive comprises a polyisocyanate component and a polyol component, wherein the polyol component includes polyester polyol and/or polyester polyurethane polyol which is produced by reaction of polyester polyol and polyisocyanate, and wherein concentration of cyclic compounds in extracted water which are extracted from a composite film bonded by the laminate adhesive by water of 0.5 mL/cm2 per unit area of the composite film is 0.5 ppb or less in terms of dibutyl phthalate concentration measured by a gas chromatograph-flame ionization detector.
    Type: Grant
    Filed: July 27, 2000
    Date of Patent: September 11, 2001
    Assignee: Takeda Cheical Industries, Ltd.
    Inventors: Shigetoshi Sasano, Sachio Igarashi
  • Patent number: 4507447
    Abstract: A polyurethane adhesive composition, which comprises an organic polyisocyanate, a polyol, an oxyacid of phosphorus or a derivative thereof, an epoxy resinand a silane coupling agent.The polyurethane adhesive composition, when used as an adhesive for packaging materials for food, provides the bond showing outstandingly excellent adhesion strength, heat resistance and hot-water resistance between metal foil such as aluminum foil and films of plastics such as polyethylene, polypropylene, nylon and polyethylene terephthalate etc.
    Type: Grant
    Filed: September 7, 1983
    Date of Patent: March 26, 1985
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Kyuya Yamazaki, Sachio Igarashi
  • Patent number: 4503189
    Abstract: Adhesive compositions, which comprise (A) a polyester polyol, polyester polyurethane polyol or their mixture, (B) a silane coupling agent, (C) a vinyl-chloride copolymerization resin, (D) a diene synthetic rubber and (E) an organic polyisocyanate.The adhesive compositions can be used as adhesives for plastic films, such as nylon, tetron and polyolefins, aluminum foil, etc., and offers particularly excellent adhesion toward metallized films, whereby the resultant bonded films, even when boiled in an alkali or acid atmosphere, remain free from discoloration or disappearance in the metallized layers.
    Type: Grant
    Filed: December 20, 1983
    Date of Patent: March 5, 1985
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Sachio Igarashi, Kyuya Yamazaki
  • Patent number: 4389519
    Abstract: A composition for polyurethane adhesives comprising (1) a triisocyanate of the formula: ##STR1## wherein ##STR2## a modified product of said triisocyanate or an adduct of said triisocyanate having terminal isocyanate groups and (2) an active hydrogen compound exhibits excellent adhesion, especially between polyethylene terephthalates, polyolefins and metals, heat resistance and weatherability, and has low toxicity and can be solventless or light solid.
    Type: Grant
    Filed: November 16, 1981
    Date of Patent: June 21, 1983
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Kyuya Yamazaki, Sachio Igarashi, Koichi Shibata
  • Patent number: 4206299
    Abstract: An adhesive composition for plastic-metal foil composite packaging materials which comprises (A) a polyester glycol having a molecular weight of 3,000 to 100,000, a polyester-polyurethane polyol having a molecular weight of 3,000 to 100,000 or a mixture thereof, (B) a silane coupling agent and (C) an organic polyisocyanate, the molar equivalent ratio (NCO/H) of isocyanate group (NCO) to active hydrogen (H) thereof being within the range of 1 to 10.The adhesive composition provides a satisfactory packaging material which does not have the problem of delamination between the metal foil and plastic film even on hot-water sterilization as it contains foods in sealed relation and which ensures long shelf lives and an improved tolerance for foodstuffs.
    Type: Grant
    Filed: February 12, 1979
    Date of Patent: June 3, 1980
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Kyuya Yamazaki, Sachio Igarashi