Abstract: The bone cement composition of the present invention comprises a liquid component including ethyl methacrylate as the main component and a powder component including an ethyl methacrylate/methyl methacrylate copolymer as the main component.

Abstract: A method of manufacturing a semiconductor integrated circuit device includes the steps of constructing a plurality of lead frames having leads which each include an inner portion and an outer portion and electrically connecting a semiconductor chip to the inner portions of the leads of each frame. The lead frames are then stacked one above each other to form a vertical stack and plates are then inserted between each of the lead frames with each plate having an opening in the center whereby a central cavity is formed in the stack. The stack is then placed between a top mold member and a bottom mold member and a resin is injected into the central cavity whereupon the resin is cured to form a single resin package encapsulating the semiconductor chips. The resin package is then released from the mold members.

Abstract: A communication system uses a two-wire circuit and includes a master terminal and a backup terminal, and a main file and a backup file along with associated link control devices coupled to a plurality of satellite terminals. Each link control device functions both as a monitor and as a communication controller with priority between the link control devices for each of the files and terminals to maintain operation of the system.