Patents by Inventor Sae KITAGAWA

Sae KITAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11527378
    Abstract: It is a CNT device (1) (carbon-metal structure) equipped with a carbon nanotube layer (2) (CNT layer 2; same hereafter) on a metal pedestal (4). The metal pedestal (4) is brazed to the CNT layer (2) with a brazing material layer (3) interposed therebetween. When manufacturing the CNT device (1), firstly, the CNT layer (2) is formed on a heat-resistant textured substrate (6). Next, the metal pedestal (4) is brazed to the CNT layer (2) that is on the heat-resistant textured substrate (6) with the brazing material layer (3) interposed therebetween. Then, the metal pedestal (4) (and the CNT layer 2) is peeled off the heat-resistant textured substrate (6) to transfer the CNT layer (2) from the heat-resistant textured substrate (6) to the metal pedestal (4).
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: December 13, 2022
    Assignees: WASEDA UNIVERSITY, MEIDENSHA CORPORATION
    Inventors: Suguru Noda, Sae Kitagawa, Kotaro Yasui, Hisashi Sugime, Daizo Takahashi, Yuichi Nishikiori, Hayato Ochi, Rena Takahashi, Toshimasa Fukai
  • Publication number: 20210375572
    Abstract: It is a CNT device (1) (carbon-metal structure) equipped with a carbon nanotube layer (2) (CNT layer 2; same hereafter) on a metal pedestal (4). The metal pedestal (4) is brazed to the CNT layer (2) with a brazing material layer (3) interposed therebetween. When manufacturing the CNT device (1), firstly, the CNT layer (2) is formed on a heat-resistant textured substrate (6). Next, the metal pedestal (4) is brazed to the CNT layer (2) that is on the heat-resistant textured substrate (6) with the brazing material layer (3) interposed therebetween. Then, the metal pedestal (4) (and the CNT layer 2) is peeled off the heat-resistant textured substrate (6) to transfer the CNT layer (2) from the heat-resistant textured substrate (6) to the metal pedestal (4).
    Type: Application
    Filed: October 21, 2019
    Publication date: December 2, 2021
    Applicants: WASEDA UNIVERSITY, MEIDENSHA CORPORATION
    Inventors: Suguru NODA, Sae KITAGAWA, Kotaro YASUI, Hisashi SUGIME, Daizo TAKAHASHI, Yuichi NISHIKIORI, Hayato OCHI, Rena TAKAHASHI, Toshimasa FUKAI