Abstract: Provided is a polyamic acid resin composition for formation of a bank, which provides excellent film characteristics and adhesion to a substrate, which can undergo patterning with use of a positive type photoresist, and which can be transformed into a polyimide after the patterning to yield a polyimide resin with upper part of film having a low surface energy. It is achieved by a polyamic acid resin composition comprising a polyamic acid [a] as a base and a polyamic acid [b] having a fluorine-containing alkyl group with a carbon number of at least 2, and containing the polyamic acid [b] in an amount of from 0.1 to 30 wt % to the total amount of the polyamic acid [a] and the polyamic acid [b].

Abstract: Provided is a polyamic acid resin composition for formation of a bank, which provides excellent film characteristics and adhesion to a substrate, which can undergo patterning with use of a positive type photoresist, and which can be transformed into a polyimide after the patterning to yield a polyimide resin with upper part of film having a low surface energy. It is achieved by a polyamic acid resin composition comprising a polyamic acid [a] as a base and a polyamic acid [b] having a fluorine-containing alkyl group with a carbon number of at least 2, and containing the polyamic acid [b] in an amount of from 0.1 to 30 wt % to the total amount of the polyamic acid [a] and the polyamic acid [b].