Patents by Inventor Sai Jayaraman

Sai Jayaraman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flux precoated solder preform for thermal interface material
    Publication number: 20080239660
    Abstract: In one embodiment, an apparatus comprises a semiconductor device, a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises a pre-coated flux material.
    Type: Application
    Filed: March 29, 2007
    Publication date: October 2, 2008
    Inventors: Lateef Mustapha, Carl Deppisch, Anna Prakash, Sai Jayaraman, Mike Reiter