Patents by Inventor Saiko KIMURA

Saiko KIMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180057648
    Abstract: The present invention provides a silicone resin transparent substrate, including one or more than one prepreg containing a silicone resin composition and a fibrous base, wherein the silicone resin transparent substrate has: an attached amount of the silicone resin composition to the fibrous base of 60% by mass or more and 99% by mass or less; a total light transmittance of 80% or more at 450 nm, as measured by a method disclosed in JIS K 7375:2008 in a thickness of 0.1 mm to 0.4 mm; and a water vapor permeability of 65 g/m2·day or less, as measured by Lyssy method in conformity with JIS K 7129:2008 in a thickness of 0.1 mm to 0.4 mm; together with a method for manufacturing the same. The silicone resin transparent substrate has excellent heat resistance and weatherability, together with flexibility, high transparency, and lower moisture permeability.
    Type: Application
    Filed: July 11, 2017
    Publication date: March 1, 2018
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Saiko KIMURA, Yoshihira HAMAMOTO
  • Publication number: 20180057638
    Abstract: The present invention provides a silicone resin substrate, including quartz cloth and a silicone resin composition, wherein the silicone resin composition contains a silicon atom-bonded aryl group in an amount of 10% by mol or more and 99% by mol or less based on the whole silicon atom-bonded organic groups contained in the silicone resin composition. The present invention also provides a metal layer-formed silicone resin substrate, a cured silicone resin substrate, and a metal layer-formed cured-silicone resin substrate, using the silicone resin substrate. Each substrate excels in heat resistance and weather resistance as well as dielectric properties at high frequency.
    Type: Application
    Filed: July 18, 2017
    Publication date: March 1, 2018
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Saiko KIMURA, Yoshihira HAMAMOTO
  • Publication number: 20160322293
    Abstract: The present invention provides a printed wiring board comprising: a conductor circuit on an insulating substrate, a white solder resist layer which is composed of a photosensitive resin composition on the insulating substrate having the conductor circuit, and a protective layer which is composed of a silicone resin composition on the white solder resist layer. The inventive printed wiring board shows superior thermo-discoloration resistivity and excellent patterning resolution.
    Type: Application
    Filed: March 28, 2016
    Publication date: November 3, 2016
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Saiko KIMURA, Yoshihira HAMAMOTO, Tsutomu KASHIWAGI