Abstract: In a Karman vortex flow meter, a first space section is provided between a detection section and an inflow opening, and a second space section is provided between the detection section and an outflow opening. The first space and the second space have cross-sectional areas larger than a cross-sectional area of the detection passage. Accordingly, a disorder of a fluid coming in the inflow opening of the detection passage and pulsation components coming from the outflow opening are reduced by the first and second spaces.

Abstract: In a Karman vortex flow meter, a first space section is provided between a detection section and an inflow opening, and a second space section is provided between the detection section and an outflow opening. The first space and the second space have cross-sectional areas larger than a cross-sectional area of the detection passage. Accordingly, a disorder of a fluid coming in the inflow opening of the detection passage and pulsation components coming from the outflow opening are reduced by the first and second spaces.

Abstract: A Karman vortex flow meter has detection passages located along a fluid flow in a duct. Flow outlets of the detection passages are disposed on an end face of a vortex generation element and flow inlets are disposed upstream from the flow outlets. Heating coils for detecting flow velocity change of a fluid caused by a negative pressure of a Karman vortex are mounted in the detection passages. A flow meter is used that lessens dust accumulation on heating coils, etc., and reliably detects Karman vortexes.

Abstract: A semiconductor pressure sensor device that improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10.

Abstract: A semiconductor pressure sensor device that can improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10.

Abstract: An apparatus for measuring an air flow intake of an internal combustion engine which comprises an air flow sensor for measuring the level of the air flow intake and an interface circuit for receiving an output signal from the sensor. The air flow sensor includes a current output circuit which outputs a current corresponding to the level of the air flow intake as the output signal of the sensor, and the interface circuit includes a current to voltage converter which converts the current from the sensor into a voltage signal and outputs it to an A/D converter included in a fuel injection unit.