Abstract: A cable for use in connection between integrated circuit elements each having terminals. The cable body has an insulator and a plurality of conductors buried in the insulator to have a matrix pattern in section. The cable body has longitudinal end faces as mounting surfaces which are for mounting the integrated circuit elements, respectively. On each of the mounting surfaces, a plurality of conductor pads are formed to connect with the conductors. The conductor pads are connected to the terminals of each of the integrated circuit elements, respectively.

Abstract: A layered structure comprising wiring layers and polyimide layers is formed on a ceramics board and a layered structure comprising wiring layers and polyimide layers is formed on an aluminum board. Both the structures are bonded together through adhesives to bring metal bumps formed on the former structure into electric contact with metal bumps formed on the surface of the latter structure and thereafter the aluminum board is removed.

Abstract: A ceramic multilayer wiring substrate having a stack of a plurality of ceramic sheets each being formed with through holes which are connected to one another by a conductive paste buried in said through holes. Among the ceramic sheets, those which constitute an intermediate layer portion each is formed with a plurality of parallel through holes which are spaced apart in the direction perpendicular to the direction of thickness of the ceramic sheet. With such through holes, the substrate reduces the resistance in the intermediate layer portion and, therefore, the conduction resistance of the entire through holes.