Patents by Inventor Sakari Tada

Sakari Tada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of recovering lead-free solder from printed circuit boards
    Patent number: 6705509
    Abstract: Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: March 16, 2004
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Sakari Tada, Eietsu Hasegawa
  • Method of recovering lead-free solder from printed circuit boards
    Publication number: 20030178470
    Abstract: Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected.
    Type: Application
    Filed: March 22, 2002
    Publication date: September 25, 2003
    Inventors: Sakari Tada, Eietsu Hasegawa