Patents by Inventor SAKET RATHI
SAKET RATHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961756Abstract: A susceptor can include a generally circular shape and may include an inner and outer susceptor. The outer susceptor can include a support region having one or more support mechanisms as well as a channel region extending from the region boundary to an outer radial boundary radially inward of an outer edge of the susceptor, the channel region can include a plurality of channels extending radially from the region boundary to the outer radial boundary. The inner susceptor can include a second plurality of channels extending from the inner radial boundary to an edge of the inner susceptor.Type: GrantFiled: January 15, 2020Date of Patent: April 16, 2024Assignee: ASM IP Holding B.V.Inventors: Uday Kiran Rokkam, Sam Kim, Saket Rathi, Dakai Bian
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Patent number: 11946137Abstract: A fixture is provided. The fixture includes a base, a turntable, a first sensor, and a second sensor. The turntable is supported on the base, is rotatable about a rotation axis, and is configured to slidably seat a susceptor assembly for rotation about the rotation axis. The first sensor is fixed relative to the base, is radially offset from the rotation axis, and is configured to determine ex-situ runout of the susceptor assembly. The second sensor is fixed relative to the first sensor, is axially offset from the first sensor, and is configured to determine ex-situ wobble of the susceptor assembly. Fixture arrangements and methods of determining ex-situ runout and ex-situ wobble of susceptor assemblies for semiconductor processing systems are also described.Type: GrantFiled: December 13, 2021Date of Patent: April 2, 2024Assignee: ASM IP Holding B.V.Inventors: Aniket Nitin Patil, Saket Rathi, Sam Kim, Shiva K. T. Rajavelu Muralidhar
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Publication number: 20230402261Abstract: Exemplary semiconductor processing systems may include an output manifold that defines at least one plasma outlet. The systems may include a gasbox disposed beneath the output manifold. The gasbox may include an inlet side facing the output manifold and an outlet side opposite the inlet side. The gasbox may include an inner wall that defines a central fluid lumen. The inner wall may taper outward from the inlet side to the outlet side. The systems may include an annular spacer disposed below the gasbox. An inner diameter of the annular spacer may be greater than a largest inner diameter of the central fluid lumen. The systems may include a faceplate disposed beneath the annular spacer. The faceplate may define a plurality of apertures extending through a thickness of the faceplate.Type: ApplicationFiled: August 28, 2023Publication date: December 14, 2023Applicant: Applied Materials, Inc.Inventors: Saket Rathi, Tuan A. Nguyen, Amit Bansal, Yuxing Zhang, Badri N. Ramamurthi, Nitin Pathak, Abdul Aziz Khaja, Sarah Michelle Bobek
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Publication number: 20230386889Abstract: A susceptor for semiconductor substrate processing is disclosed herein. In some embodiments, the susceptor may comprise an inner susceptor portion and an outer susceptor portion. The susceptor portions may self-align via complementary features, such as tabs on the outer susceptor and recesses on the inner susceptor portion. The inner susceptor portion may contain several contact pads with which to support a wafer during semiconductor processing. In some embodiments, the contact pads are hemispherical to reduce contact area with the wafer, thereby reducing risk of backside damage. The inner susceptor portion may contain a cavity with which to receive a thermocouple. In some embodiments, the diameter of the cavity is greater than the diameter of the thermocouple such that the thermocouple does not contact the walls of the cavity during processing, thereby providing highly accurate temperature measurements.Type: ApplicationFiled: August 11, 2023Publication date: November 30, 2023Inventors: Saket Rathi, Shiva K.T. Rajavelu Muralidhar, Siyao Luan, Alexandros Demos, Xing Lin
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Patent number: 11764101Abstract: A susceptor for semiconductor substrate processing is disclosed herein. In some embodiments, the susceptor may comprise an inner susceptor portion and an outer susceptor portion. The susceptor portions may self-align via complementary features, such as tabs on the outer susceptor and recesses on the inner susceptor portion. The inner susceptor portion may contain several contact pads with which to support a wafer during semiconductor processing. In some embodiments, the contact pads are hemispherical to reduce contact area with the wafer, thereby reducing risk of backside damage. The inner susceptor portion may contain a cavity with which to receive a thermocouple. In some embodiments, the diameter of the cavity is greater than the diameter of the thermocouple such that the thermocouple does not contact the walls of the cavity during processing, thereby providing highly accurate temperature measurements.Type: GrantFiled: October 20, 2020Date of Patent: September 19, 2023Assignee: ASM IP Holding, B.V.Inventors: Saket Rathi, Shiva K. T. Rajavelu Muralidhar, Siyao Luan, Alexandros Demos, Xing Lin
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Patent number: 11742185Abstract: Exemplary semiconductor processing systems may include an output manifold that defines at least one plasma outlet. The systems may include a gasbox disposed beneath the output manifold. The gasbox may include an inlet side facing the output manifold and an outlet side opposite the inlet side. The gasbox may include an inner wall that defines a central fluid lumen. The inner wall may taper outward from the inlet side to the outlet side. The systems may include an annular spacer disposed below the gasbox. An inner diameter of the annular spacer may be greater than a largest inner diameter of the central fluid lumen. The systems may include a faceplate disposed beneath the annular spacer. The faceplate may define a plurality of apertures extending through a thickness of the faceplate.Type: GrantFiled: March 26, 2021Date of Patent: August 29, 2023Assignee: Applied Materials, Inc.Inventors: Saket Rathi, Tuan A. Nguyen, Amit Bansal, Yuxing Zhang, Badri N. Ramamurthi, Nitin Pathak, Abdul Aziz Khaja, Sarah Michelle Bobek
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Patent number: 11697877Abstract: Embodiments of the disclosure relate to faceplates for a processing chamber. In one example, a faceplate includes a body having a plurality of apertures formed therethrough. A heating element is disposed within the body, and the heating element circumscribes the plurality of apertures. A support ring is disposed the body. The support ring circumscribes the heating element. The support ring includes a main body and a cantilever extending radially inward from the main body. The cantilever contacts the body of the faceplate.Type: GrantFiled: December 28, 2021Date of Patent: July 11, 2023Assignee: Applied Materials, Inc.Inventors: Amit Kumar Bansal, Saket Rathi, Tuan Anh Nguyen
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Publication number: 20220307129Abstract: The present disclosure relates to a cleaning assemblies, components thereof, and methods associated therewith for substrate processing chambers. In one example, a cleaning assembly for a substrate processing chamber includes a distribution ring. The distribution ring comprises a body with an inlet and an outlet. The outlet is fluidly coupled to an internal volume of the substrate processing chamber via a sidewall of the substrate processing chamber. The cleaning assembly includes a cleaning conduit configured to fluidly couple a gas manifold to the distribution ring for diverting a first portion of cleaning fluid from the gas manifold to the distribution ring.Type: ApplicationFiled: March 23, 2021Publication date: September 29, 2022Inventors: Yuxing Zhang, Tuan Anh Nguyen, Amit Kumar Bansal, Nitin Pathak, Saket Rathi, Thomas Rubio, Udit S. Kotagi, Badri N. Ramamurthi, Dharma Ratnam Srichurnam
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Publication number: 20220310360Abstract: Exemplary semiconductor processing systems may include an output manifold that defines at least one plasma outlet. The systems may include a gasbox disposed beneath the output manifold. The gasbox may include an inlet side facing the output manifold and an outlet side opposite the inlet side. The gasbox may include an inner wall that defines a central fluid lumen. The inner wall may taper outward from the inlet side to the outlet side. The systems may include an annular spacer disposed below the gasbox. An inner diameter of the annular spacer may be greater than a largest inner diameter of the central fluid lumen. The systems may include a faceplate disposed beneath the annular spacer. The faceplate may define a plurality of apertures extending through a thickness of the faceplate.Type: ApplicationFiled: March 26, 2021Publication date: September 29, 2022Applicant: Applied Materials, Inc.Inventors: Saket Rathi, Tuan A. Nguyen, Amit Bansal, Yuxing Zhang, Badri N. Ramamurthi, Nitin Pathak, Abdul Aziz Khaja, Sarah Michelle Bobek
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Publication number: 20220186369Abstract: A fixture is provided. The fixture includes a base, a turntable, a first sensor, and a second sensor. The turntable is supported on the base, is rotatable about a rotation axis, and is configured to slidably seat a susceptor assembly for rotation about the rotation axis. The first sensor is fixed relative to the base, is radially offset from the rotation axis, and is configured to determine ex-situ runout of the susceptor assembly. The second sensor is fixed relative to the first sensor, is axially offset from the first sensor, and is configured to determine ex-situ wobble of the susceptor assembly. Fixture arrangements and methods of determining ex-situ runout and ex-situ wobble of susceptor assemblies for semiconductor processing systems are also described.Type: ApplicationFiled: December 13, 2021Publication date: June 16, 2022Inventors: Aniket Nitin Patil, Saket Rathi, Sam Kim, Shiva K.T. Rajavelu Muralidhar
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Publication number: 20220119950Abstract: Embodiments of the disclosure relate to faceplates for a processing chamber. In one example, a faceplate includes a body having a plurality of apertures formed therethrough. A heating element is disposed within the body, and the heating element circumscribes the plurality of apertures. A support ring is disposed the body. The support ring circumscribes the heating element. The support ring includes a main body and a cantilever extending radially inward from the main body. The cantilever contacts the body of the faceplate.Type: ApplicationFiled: December 28, 2021Publication date: April 21, 2022Inventors: Amit Kumar BANSAL, Saket RATHI, Tuan Anh NGUYEN
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Patent number: 11242600Abstract: Embodiments of the disclosure relate to faceplates for a processing chamber. In one example, a faceplate includes a body having a plurality of apertures formed therethrough. A heating element is disposed within the body, and the heating element circumscribes the plurality of apertures. A support ring is disposed in the body. The support ring circumscribes the heating element. The support ring includes a main body and a cantilever extending radially inward from the main body. The cantilever contacts the body of the faceplate.Type: GrantFiled: June 17, 2020Date of Patent: February 8, 2022Assignee: Applied Materials, Inc.Inventors: Amit Kumar Bansal, Saket Rathi, Tuan Anh Nguyen
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Publication number: 20210395881Abstract: Embodiments of the disclosure relate to faceplates for a processing chamber. In one example, a faceplate includes a body having a plurality of apertures formed therethrough. A heating element is disposed within the body, and the heating element circumscribes the plurality of apertures. A support ring is disposed in the body. The support ring circumscribes the heating element. The support ring includes a main body and a cantilever extending radially inward from the main body. The cantilever contacts the body of the faceplate.Type: ApplicationFiled: June 17, 2020Publication date: December 23, 2021Inventors: Amit Kumar BANSAL, Saket RATHI, Tuan Anh NGUYEN
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Publication number: 20210125853Abstract: A susceptor for semiconductor substrate processing is disclosed herein. In some embodiments, the susceptor may comprise an inner susceptor portion and an outer susceptor portion. The susceptor portions may self-align via complementary features, such as tabs on the outer susceptor and recesses on the inner susceptor portion. The inner susceptor portion may contain several contact pads with which to support a wafer during semiconductor processing. In some embodiments, the contact pads are hemispherical to reduce contact area with the wafer, thereby reducing risk of backside damage. The inner susceptor portion may contain a cavity with which to receive a thermocouple. In some embodiments, the diameter of the cavity is greater than the diameter of the thermocouple such that the thermocouple does not contact the walls of the cavity during processing, thereby providing highly accurate temperature measurements.Type: ApplicationFiled: October 20, 2020Publication date: April 29, 2021Inventors: Saket Rathi, Shiva K.T. Rajavelu Muralidhar, Siyao Luan, Alexandros Demos, Xing Lin
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Patent number: 10945313Abstract: In some embodiments, a process chamber for a microwave batch curing process includes: an annular body having an outer surface and an inner surface defining a central opening of the annular body, wherein the inner surface comprises a plurality of angled surfaces defining a first volume; a first lip extending radially outward from the outer surface of the annular body proximate a first end of the annular body; a second lip extending radially outward from the outer surface of the annular body proximate a second end of the annular body; an exhaust disposed between the first lip and the second lip and fluidly coupled to the first volume, wherein the exhaust comprises a plurality of first openings; a plurality of second openings fluidly coupled to the first volume, wherein the plurality of second openings are configured to expose the first volume to microwave energy; and one or more ports fluidly coupled to the first volume.Type: GrantFiled: May 26, 2016Date of Patent: March 9, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Saket Rathi, Ananthkrishna Jupudi, Mukund Sundararajan, Manjunath Handenahalli Venkataswamappa
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Patent number: D914620Type: GrantFiled: January 17, 2019Date of Patent: March 30, 2021Assignee: ASM IP Holding B.V.Inventors: Uday Kiran Rokkam, Sam Kim, Saket Rathi, Dakai Bian
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Patent number: D920936Type: GrantFiled: January 17, 2019Date of Patent: June 1, 2021Assignee: ASM IP Holding B.V.Inventors: Uday Kiran Rokkam, Sam Kim, Saket Rathi, Dakai Bian
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Patent number: D958764Type: GrantFiled: May 4, 2021Date of Patent: July 26, 2022Assignee: ASM IP HOLDING B.V.Inventors: Uday Kiran Rokkam, Sam Kim, Saket Rathi, Dakai Bian
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Patent number: D965044Type: GrantFiled: August 19, 2019Date of Patent: September 27, 2022Assignee: ASM IP Holding B.V.Inventors: Aniket Patil, Sam Kim, John DiSanto, Saket Rathi
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Patent number: D965524Type: GrantFiled: August 19, 2019Date of Patent: October 4, 2022Assignee: ASM IP Holding B.V.Inventors: Aniket Patil, John DiSanto, Sam Kim, Saket Rathi