Patents by Inventor Saligrama N. Subbarao

Saligrama N. Subbarao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capacitor and method for making same with high yield
    Patent number: 4731695
    Abstract: A capacitor comprises a pair of electrodes with an insulator between the electrodes. The insulator has a primary dielectric with at least one void. A fill dielectric is in the void to improve yield.A method of making a capacitor comprises forming a first electrode, forming a primary dielectric having a void over the electrode, forming a fill dielectric in the void, and forming a second electrode over the dielectrics.
    Type: Grant
    Filed: February 17, 1987
    Date of Patent: March 15, 1988
    Assignee: General Electric Company
    Inventors: Richard Brown, Phillip C. Jozwiak, Saligrama N. Subbarao
  • Method for fabricating via holes in a semiconductor wafer
    Patent number: 4348253
    Abstract: A circuit pattern is formed on a front side surface of a semiconductor wafer and an apertured photoresist pattern is formed over the circuit pattern. Via holes are then formed by laser irradiating the wafer at sites corresponding to the photoresist apertures. The back side surface of the wafer is next metallized and this surface is adhered to a plating block by means of an adhesive layer. Electrical connection between the substrate and plating block is then made, the via holes are electroplated, and the substrate is separated from the plating block and adhesive layer.
    Type: Grant
    Filed: November 12, 1981
    Date of Patent: September 7, 1982
    Assignee: RCA Corporation
    Inventors: Saligrama N. Subbarao, Ho-Chung Huang