Patents by Inventor Sam CALISCH
Sam CALISCH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11203157Abstract: Embodiments disclosed herein provide systems and methods for preparing geometry for 3D printing. In one embodiment, a 3D printing preparation application receives 3D geometry and repairs non-manifold edges and non-manifold vertices, producing a topological manifold geometry. The 3D printing preparation application then welds coincident edges without coincident faces and fills holes in the geometry. The 3D printing preparation application may further perform resolution-aware thickening of the geometry by estimating distances to a medial axis based on distances to distance field shocks, and advecting the distance field using a velocity field. A similar approach may be used to perform resolution-aware separation enforcement. Alternatively, one component may be globally thickened and subtracted from another for separation enforcement. The 3D printing preparation application may also split large models and add connectors for connecting the split pieces after printing.Type: GrantFiled: April 2, 2019Date of Patent: December 21, 2021Assignee: AUTODESK, INC.Inventors: Saul Griffith, Martin Wicke, Keith Pasko, Geoffrey Irving, Sam Calisch, Tucker Gilman, Daniel Benoit, Jonathan Bachrach
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Patent number: 10576701Abstract: A process for producing a composite part includes (a) applying a loose carbon filament to a receiving portion of a first mold piece; (b) reversibly coupling the first mold piece with at least a second mold piece to form a first mold layer, wherein an interior region of the first mold layer includes a pocket configured to receive a curable resin, the pocket having a shape of the composite part; (c) infusing the curable resin into the pocket; and (d) curing the resin to form the composite part.Type: GrantFiled: December 7, 2015Date of Patent: March 3, 2020Assignee: Massachusetts Institute of TechnologyInventors: Sam Calisch, Neil Gershenfeld, Spencer Wilson
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Publication number: 20190228114Abstract: Embodiments disclosed herein provide systems and methods for preparing geometry for 3D printing. In one embodiment, a 3D printing preparation application receives 3D geometry and repairs non-manifold edges and non-manifold vertices, producing a topological manifold geometry. The 3D printing preparation application then welds coincident edges without coincident faces and fills holes in the geometry. The 3D printing preparation application may further perform resolution-aware thickening of the geometry by estimating distances to a medial axis based on distances to distance field shocks, and advecting the distance field using a velocity field. A similar approach may be used to perform resolution-aware separation enforcement. Alternatively, one component may be globally thickened and subtracted from another for separation enforcement. The 3D printing preparation application may also split large models and add connectors for connecting the split pieces after printing.Type: ApplicationFiled: April 2, 2019Publication date: July 25, 2019Inventors: Saul GRIFFITH, Martin WICKE, Keith PASKO, Geoffrey IRVING, Sam CALISCH, Tucker GILMAN, Daniel BENOIT, Jonathan BACHRACH
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Patent number: 10248740Abstract: Embodiments disclosed herein provide systems and methods for preparing geometry for 3D printing. In one embodiment, a 3D printing preparation application receives 3D geometry and repairs non-manifold edges and non-manifold vertices, producing a topological manifold geometry. The 3D printing preparation application then welds coincident edges without coincident faces and fills holes in the geometry. The 3D printing preparation application may further perform resolution-aware thickening of the geometry by estimating distances to a medial axis based on distances to distance field shocks, and advecting the distance field using a velocity field. A similar approach may be used to perform resolution-aware separation enforcement. Alternatively, one component may be globally thickened and subtracted from another for separation enforcement. The 3D printing preparation application may also split large models and add connectors for connecting the split pieces after printing.Type: GrantFiled: April 9, 2013Date of Patent: April 2, 2019Assignee: AUTODESK, INC.Inventors: Saul Griffith, Martin Wicke, Keith Pasko, Geoffrey Irving, Sam Calisch, Tucker Gilman, Daniel Benoit, Jonathan Bachrach
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Patent number: 9619587Abstract: Embodiments disclosed herein provide techniques for decomposing 3D geometry into developable surface patches and cut patterns. In one embodiment, a decomposition application receives a triangulated 3D surface as input and determines approximately developable surface patches from the 3D surface using a variant of k-means clustering. Such approximately developable surface patches may have undesirable jagged boundaries, which the decomposition application may eliminate by generating a data structure separate from the mesh that contains patch boundaries and optimizing the patch boundaries or, alternatively, remeshing the mesh such that patch boundaries fall on mesh edges. The decomposition application may then flatten the patches into truly developable surfaces by re-triangulating the patches as ruled surfaces. The decomposition application may further flatten the ruled surfaces into 2D shapes and lay those shapes out on virtual sheets of material.Type: GrantFiled: April 9, 2013Date of Patent: April 11, 2017Assignee: AUTODESK, INC.Inventors: Saul Griffith, Martin Wicke, Keith Pasko, Geoffrey Irving, Sam Calisch, Tucker Gilman, Daniel Benoit, Jonathan Bachrach
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Publication number: 20160193792Abstract: A process for producing a composite part includes (a) applying a loose carbon filament to a receiving portion of a first mold piece; (b) reversibly coupling the first mold piece with at least a second mold piece to form a first mold layer, wherein an interior region of the first mold layer includes a pocket configured to receive a curable resin, the pocket having a shape of the composite part; (c) infusing the curable resin into the pocket; and (d) curing the resin to form the composite part.Type: ApplicationFiled: December 7, 2015Publication date: July 7, 2016Inventors: Sam Calisch, Neil Gershenfeld, Spencer Wilson
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Publication number: 20130297059Abstract: Embodiments disclosed herein provide systems and methods for preparing geometry for 3D printing. In one embodiment, a 3D printing preparation application receives 3D geometry and repairs non-manifold edges and non-manifold vertices, producing a topological manifold geometry. The 3D printing preparation application then welds coincident edges without coincident faces and fills holes in the geometry. The 3D printing preparation application may further perform resolution-aware thickening of the geometry by estimating distances to a medial axis based on distances to distance field shocks, and advecting the distance field using a velocity field. A similar approach may be used to perform resolution-aware separation enforcement. Alternatively, one component may be globally thickened and subtracted from another for separation enforcement. The 3D printing preparation application may also split large models and add connectors for connecting the split pieces after printing.Type: ApplicationFiled: April 9, 2013Publication date: November 7, 2013Inventors: Saul GRIFITH, Martin WICKE, Keith PASKO, Geoffrey IRVING, Sam CALISCH, Tucker GILMAN, Daniel BENOIT, Jonathan BACHRACH
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Publication number: 20130297058Abstract: Embodiments disclosed herein provide techniques for decomposing 3D geometry into developable surface patches and cut patterns. In one embodiment, a decomposition application receives a triangulated 3D surface as input and determines approximately developable surface patches from the 3D surface using a variant of k-means clustering. Such approximately developable surface patches may have undesirable jagged boundaries, which the decomposition application may eliminate by generating a data structure separate from the mesh that contains patch boundaries and optimizing the patch boundaries or, alternatively, remeshing the mesh such that patch boundaries fall on mesh edges. The decomposition application may then flatten the patches into truly developable surfaces by re-triangulating the patches as ruled surfaces. The decomposition application may further flatten the ruled surfaces into 2D shapes and lay those shapes out on virtual sheets of material.Type: ApplicationFiled: April 9, 2013Publication date: November 7, 2013Inventors: Saul GRIFFITH, Martin WICKE, Keith PASKO, Geoffrey IRVING, Sam CALISCH, Tucker GILMAN, Daniel BENOIT, Jonathan BACHRACH