Patents by Inventor Sam Her

Sam Her has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080053688
    Abstract: Disclosed herein are a thin printed circuit board, in which a pair of high-functional resin substrates having a permittivity ranging from 1.5 to 4.0, on one surface of each of which a circuit pattern is formed through ion-beam surface treatment, vapor deposition and electroplating, are layered with an insulating layer interposed therebetween, and a method of manufacturing the printed circuit board. The circuit patterns are positioned inside the substrates. Thereafter, external layers are formed through ion-beam surface treatment, vapor deposition and electroplating. According to the present invention, the adhesiveness between each of the substrates and a metal layer may be improved through the ion-beam surface treatment/vapor deposition.
    Type: Application
    Filed: August 30, 2007
    Publication date: March 6, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Park, Taehoon Kim, Dong Kim, Sam Her, Seung Kim
  • Publication number: 20080038523
    Abstract: Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The printed circuit board includes an insulating material; a via-hole formed in a given location of the insulating material; a copper seed layer formed through ion beam surface treatment and vacuum deposition on the surface of the insulating material having the via-hole formed therein; and a copper pattern plating layer formed on a given region of the insulating material, which has the copper seed layer formed thereon, and in the via-hole.
    Type: Application
    Filed: July 20, 2007
    Publication date: February 14, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Kim, Taehoon Kim, Jong Song, Sam Her, Jun Park
  • Publication number: 20070138133
    Abstract: Through holes for flow paths of the fuel cell are formed in a thermoplastic polymer film by a process selected from a group consisting of laser drilling, etching and lithography, an inner side surface of the thermoplastic polymer film is coated with a metal layer, and the through holes are filled with a fuel diffusion material and a catalyst to provide an anode. The procedure is repeated to provide a cathode. Then, the anode and the cathode are placed to oppose each other. A cation conducting polymer membrane is disposed, between the anode and the cathode, and the anode, the cation conducting polymer membrane and the cathode are hot-pressed.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 21, 2007
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Cha, Tae Kim, Chang Ryu, Sam Her, Sung Kim