Abstract: The present invention relates to a filter and a plasma display device thereof, wherein the filter includes an external light shielding sheet which comprises a base unit, and a plurality of pattern units that are formed on the base unit, wherein a bottom, which is wider than a top, of the pattern units is formed as a concave shape. According to the present invention, the plasma display device of the present invention can effectively realize black images and enhance bright room contrast, as an external light shielding sheet, which absorbs and shields as much external light incident upon a plasma display panel PDP as possible, is disposed at a front of the plasma display panel. Also, the sharpness of the display images may be enhanced by reducing the bleeding phenomenon of the display images as well as the adhesiveness of the filter may be enhanced by forming the bottom of the pattern units of the external light shielding sheet as a concave shape in which the center area is depressed into the inside.

Abstract: The present invention relates to an external light shielding sheet and a plasma display device thereof, and the plasma display device comprises a plasma display panel(PDP); and an external light shielding sheet, which is disposed at a front of the PDP and includes a base unit and a plurality of pattern units which are formed on the base unit and absorb external light, wherein at least one of the plurality of pattern units has an ascending portion with an average slope of 0.5 to 45 degrees and a descending portion with an average slope of ?45 to ?0.5 degrees. According to the present invention, it is possible to effectively realize black images and enhance bright room contrast by arranging the external light shielding sheet, which absorbs and shields external light from the outside, at the front of the display panel(PDP).

Abstract: Disclosed are a driving apparatus of a PDP to decrease the size of the PDP as well as to enhance electrical characteristics by mounting a plurality of control chips and memories on a single package, and a fabrication method thereof. The driving apparatus includes a multi-chip module in which at least one control chip having a control circuit for controlling the PDP, and at least one memory are mounted on a single package, wherein the multi-chip module is mounted on a printed circuit board (PCB) of a control board.

Abstract: Disclosed is a semiconductor package and method for package a semiconductor that has high reliability. A semiconductor package according to the present invention comprises a first substrate on which a circuit pattern and an electrode pad are formed; a second substrate which is adhered to the first substrate and on which a hole is formed; and a solder ball adhered to the electrode pad through the hole formed on the second substrate. Then, the second substrate is used as a solder resist.