Abstract: An electronic device or a component thereof is described, which may include communication and/or thermal interconnects. The device may include hingedly coupled portions, where the interconnects are axially arranged (e.g., coincident) with respect to a hinge axis of the foldable electronic device.

Abstract: Techniques are described to address issues for repairing and/or servicing electronic components through the use of retaining assemblies that use bimetal retaining mechanisms. The bimetal retaining mechanisms may comprise various shapes such as hooks, snap-hooks, clips, etc., and facilitate a temperature-selective removal of various electronic components such as displays, EMI shields, etc. without damaging these components and without compromising the thickness and weight of the electronic device. External heating systems may be used to trigger actuation of the bimetal retaining mechanisms, resulting in their release. Alternatively, internal electronic device heating systems may be used.

Abstract: In one embodiment, a hinge apparatus includes two curved rack apparatuses, each curved rack apparatus defining an arcuate surface and an arcuate set of gear teeth concentric with the arcuate surface, where the radius of curvature of the arcuate set of gear teeth being non-uniform. The hinge apparatus further includes a gear assembly that includes a first gear, a second gear, a third gear coupling the first and second gears, a fourth gear coupling the first gear and the arcuate set of gear teeth of the first curved rack apparatus, and a fifth gear coupling the second gear and the arcuate set of gear teeth of the second curved rack apparatus.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate, where the substrate comprises glass, and buildup layers over the first substrate. In an embodiment, a first die is over the buildup layers, a second die is over the buildup layers and adjacent to the first die, and where conductive routing in the buildup layers electrically couples the first die to the second die.

Abstract: In one embodiment, an AC ionic blower apparatus includes a housing defining a hole through the housing, a first electrode formed around the hole, a second electrode formed around the hole, and a dielectric material between the first electrode and the second electrode. The center of the second electrode is offset from the center of the first electrode.

Abstract: Systems, apparatuses and methods may provide for power adapter technology that includes an adapter plug having a housing, a plurality of contacts positioned within the housing, wherein the plurality of contacts includes one or more configuration channel contacts, and a piezoelectric membrane positioned on an external surface of the housing, wherein the piezoelectric membrane is electrically connected to the one or more configuration channel contacts. Additionally, sink device technology may detect a signal from the piezoelectric membrane of the adapter plug via the configuration channel contact(s), wherein the signal indicates user contact with the adapter plug, and disconnect a bulk capacitor from a receptacle adjacent to the adapter plug in response to a disconnect condition associated with the user contact.

Abstract: A back-to-back ultra-slim module (USM) includes an inline USM (USMi) connector and a top mount USM (USMt) connector. The back-to-back USM assembly can be made as a double-sided module to allow a stacked module configuration to save system area. The stacked module has a USMi module inline with the system board on one side of the system board, and a USMt module vertically offset from the other side of the system board. The stacked module can have a thermal layer between the USMi module and the USMt module.

Abstract: Capacitors are commonly used in design and manufacturing of PCBs, which may exhibit a vibration effect, such as a piezoelectric effect. This vibration may induce acoustic noise. PCB capacitor-induced acoustic noise mitigation may include receiving an AC input that is converted and applied to a voltage rail, which may be used by first capacitor set. An additional capacitor set may receive and invert the voltage rail signal and oscillate (e.g., vibrate) out of phase with the first capacitor set, such that the second capacitor set mitigates or cancels the acoustic noise generated by the first capacitor set.

Abstract: An apparatus includes a memory interposer including a socket including an inner surface, one or more memories disposed on the inner surface, a bottom surface opposite to the inner surface, and pogo pins disposed on the bottom surface and respectively corresponding to the one or more memories, the pogo pins being configured to connect the one or more memories to a printed circuit board (PCB) including a semiconductor die. The apparatus further includes an intermediate thermal head attached to the memory interposer. The memory interposer is movable with respect to the intermediate thermal head.

Abstract: Dynamically modifiable air movers can be modified during operation of a computing system to allow the performance of the fan (air flow, air flow split between exhausts) to be adjusted based on a workload being performed by the system. The physical modifications that an air mover can undergo are physical in nature and include adjusting the placement of one or more cutwaters, expanding or contracting an expandable portion of the fan housing, covering or uncovering an exhaust to provide or remove cooling to memory components, and moving a slidable strip to extend or withdraw from an exhaust. Causing one or more of these physical modifications to be made can be performed in response to the system determining that a temperature, rate of temperature change, power consumption level, rate of power consumption level change of the system or system components exceeds or has dropped below a threshold level.

Abstract: Particular embodiments described herein provide for an electronic device can include a support structure, a radiation source on the support structure, and a radiation shield around the radiation source. The radiation shield includes a wall secured to the support structure, a vacuum bag on the wall, where the vacuum bag has an inside air pressure less than an air pressure outside the vacuum bag, and a lid. The air pressure inside the vacuum bag is less than the atmospheric pressure outside the vacuum bag. When the vacuum is created in the vacuum bag, the vacuum bag deforms and compresses to help provide a vacuum-based mechanical loading that helps to create an applied load on the one or more radiation sources by the lid.

Abstract: Low-profile fasteners with springs that are either integrated with the fastener or are a physically separate component can provide a more evenly distributed load to a heat transfer device, such as a vapor chamber or a heat pipe. The low-profile fasteners do not increase the height of the base of a mobile computing device as the spring and the portion of the fastener that extends past the spring fit within a recess or cavity of the heat transfer device. The spring can be a diaphragm spring, a wave spring, or another suitable spring. The use of low-profile fasteners with springs to fasten a heat transfer device to a mainboard may allow for designs with a smaller mainboard area, which can leave room for a larger thermal management solution (which can increase cooling capacity) and allow for a greater thermal design power for the system.

Abstract: There is disclosed in one example, an encasement for a mobile computer, including: an external casing in a clamshell form factor, the external casing including a base, a secondary display chassis hingedly connected to the base at a secondary hinge, and a primary display chassis hingedly connected to the secondary display chassis at a primary hinge disposed at a removed edge of the secondary display chassis from the secondary hinge, the primary display chassis to substantially overlay the secondary display chassis and the base when the primary hinge is in a closed position; and pivot means disposed to substantially bias the secondary hinge against movement from a selected position in at least one direction in the absence of an electrical input.

Abstract: Techniques for overlay surfaces for compute devices are disclosed. In one embodiment, an overlay surface on a base portion of a compute device can be moved from a folded or closed position (in which it does not cover the keyboard) to an unfolded or open position (in which it covers part of the keyboard). The base portion includes a touch sensor that allows the overlay surface to be used as a touch surface. In another embodiment, an overlay surface of a compute device is movable from one position adjacent a display of the compute device to another position adjacent a base of the compute device. The overlay surface is electrically switchable from a transparent state to an opaque state, allowing the display to be seen through it in one position and allowing it to be used as an opaque drawing surface in another position.

Abstract: Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to receive data related to a gaze of a user, determine that a display should be adjusted based on the received data related to the gaze of the user, and activate a motor, where the motor causes the height of the display to be adjusted. In an example, the electronic device can also determine that the display should be rotated based on the received data related to the gaze of the user and rotate the display.

Abstract: Apparatus, systems, and methods for display panel power savings during stylus usage are disclosed. An example apparatus includes interface circuitry to receive touch event location data indicative of touch events by a user on a display screen of an electronic device; and processor circuitry to perform operations to instantiate display mapping circuitry to identify an area of the display screen covered by a portion of a body of the user based on a shape of the portion; and pixel identification circuitry to identify respective ones of pixels of the display screen in the area of the display screen; and cause a property of the respective ones of the pixels to be adjusted.

Abstract: Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis, a first fan including a first outlet and a second outlet, and a second fan having a third outlet and a fourth outlet. In the example electronic device, the first fan is to exhaust air through the first outlet and the second fan is to exhaust air through the third outlet to create a positive pressure in the chassis. The first fan is to exhaust air through the second outlet to an exterior of the chassis, and the second fan is to exhaust air through the fourth outlet to an exterior of the chassis.

Abstract: Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis including a first cover and a second cover. The example electronic device also includes a first looped frame spaced apart from the first cover, a second looped frame spaced apart from the second cover, and a printed circuit board between the first looped frame and the second looped frame.

Abstract: Illustrative examples include a system for coupling a first electronic device to a second electronic device. The first electronic device may include a housing having a first engagement surface and a first magnet array. The first engagement surface may be adapted to receive the second electronic device. The second electronic device may include a second magnet array. An actuator coupled to the first magnet array may move the first magnet array relative to the housing and the second magnetic array, to attractively couple or repulsively de-couple the second electronic device from the first electronic device.