Abstract: A 3-D memory module comprising a plurality of packaged integrated memory circuits or devices is mounted to a substrate with integrated pins that are edge-connected on two surfaces where the top surface provides an edge connection from the integrated memory circuits to an orthogonally-mounted memory controller circuit through a wide-word interface. Each integrated memory device can be accessed independently wherein the memory controller is configured to reduce the wide-word interface to a serial interface which is brought to the opposite surface of the memory module for electrical coupling to an external system or printed circuit assembly.