Patents by Inventor Sambhu KUNDU

Sambhu KUNDU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240142290
    Abstract: Methods and systems for the measurement of molten metal and metal alloy levels within a crucible are provided. The system includes a crucible, a probe having an electrode disposed at a lowermost probe position, and a processing system configured to receive a signal from the electrode to evaluate whether the electrode is in contact with the liquid metal. The system can include a plurality of probes, with each probe having an electrode positioned at a different height within the crucible interior. A multi-probe system can inform a system user on molten metal levels at various sectors within the crucible interior.
    Type: Application
    Filed: October 20, 2023
    Publication date: May 2, 2024
    Inventors: Ajay Balaram MORE, Sambhu KUNDU, PrasannaKalleshwara Buddappa RAMACHANDRAPPA, Terry BLUCK, Visweswaren SIVARAMAKRISHNAN
  • Publication number: 20230048728
    Abstract: A method and apparatus for thermal evaporation are provided. The thermal evaporator includes a flat crucible design, which provides an increased surface area for evaporation of the material to be deposited relative to conventional designs. The increased surface area for evaporation means that the more vapor of the evaporated material can be produced, which increases pressure inside the evaporator body leading to increased flow of the evaporated material out of the nozzles. The flat crucible can be attached to an evaporator body of the thermal evaporator. The flat crucible can be integrated within the evaporator body. The evaporator body can include a plurality of longitudinal grooves, which increase the surface area of the evaporator body. The thermal evaporator can include a plurality of baffles which divide the thermal evaporator into separate compartments.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 16, 2023
    Inventors: Sambhu KUNDU, PrasannaKalleshwara Buddappa RAMACHANDRAPPA, Vicente M. LIM, Subramanya P. HERLE, Visweswaren SIVARAMAKRISHNAN
  • Publication number: 20220372614
    Abstract: Embodiments of the present disclosure generally relate to flexible substrate fabrication. In particular, embodiments described herein relate to an apparatus and methods for flexible substrate fabrication using nip rollers to improve tension uniformity. In one embodiment, a roller assembly includes a primary roller for transporting a flexible substrate, wherein the primary roller has a first end and a second end, wherein the flexible substrate has a coating disposed hereon, and wherein one or more edge regions are not covered by the coating. The roller assembly further includes a first nip roller disposed at the first end of the primary roller that contacts a first edge region of the one or more edge regions, and a second nip roller disposed at the second end of the primary roller that contacts a second edge region of the one or more edge regions.
    Type: Application
    Filed: April 28, 2022
    Publication date: November 24, 2022
    Inventors: Sambhu KUNDU, PrasannaKalleshwara Buddappa RAMACHANDRAPPA, Subramanya P. HERLE, Visweswaren SIVARAMAKRISHNAN
  • Publication number: 20220333231
    Abstract: A method, system, and evaporation source for reactive deposition is provided. The system includes a deposition surface operable for depositing a material onto a substrate provided on the deposition surface. The system further includes an evaporation source positioned for depositing the material onto the substrate. The evaporation source includes a crucible. The crucible includes a base and at least one sidewall extending upward from the base and defining an interior region of the crucible. The evaporation source further includes a cooling mechanism. The cooling mechanism includes a cylindrical cooling jacket surrounding an outer surface of the at least one sidewall while leaving a bottom surface of the base exposed, wherein a cooling gap is defined between the outer surface of the at least one sidewall of the crucible and an inner surface of a sidewall of the cylindrical cooling jacket.
    Type: Application
    Filed: March 28, 2022
    Publication date: October 20, 2022
    Inventors: Sambhu KUNDU, PrasannaKalleshwara Buddappa RAMACHANDRAPPA, Sumedh Dattatraya ACHARYA, Subramanya P. HERLE, Nilesh Chimanrao BAGUL, Visweswaren SIVARAMAKRISHNAN
  • Publication number: 20220328803
    Abstract: A method and apparatus for fabricating electrodes used in energy storage devices are provided. In some implementations a surface of the electrode is activated for (a) a pre-treatment process to remove loosely held particles from the electrode surface; (b) a pre-treatment process to activate the surface of the electrode material for improved bonding or wetting for subsequently deposited materials; (c) a post-treatment of the pre-lithiation layer to improve subsequent bonding with additionally deposited layer, for example, passivation layers; and/or (d) a post-treatment of the pre-lithiation layer to improve/accelerate absorption of the lithium into the underlying electrode material.
    Type: Application
    Filed: April 7, 2022
    Publication date: October 13, 2022
    Inventors: SUBRAMANYA P. HERLE, Girish Kumar Gopalakrishnan Nair, Daniel Stock, Sambhu Kundu, Ezhiylmurugan Rangasamy
  • Patent number: 10826158
    Abstract: A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal. The antenna has (i) an inner terminal continuous with the uppermost layer of metal or connected to the uppermost layer of metal through one or more contacts, and (ii) an outer terminal connected to the uppermost layer of metal through one or more contacts and optionally a metal bridge or strap.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 3, 2020
    Assignee: Thin Film Electronics ASA
    Inventors: Somnath Mukherjee, Aditi Chandra, Mao Ito, Arvind Kamath, Scott Bruner, Sambhu Kundu, Anand Deshpande
  • Publication number: 20190267698
    Abstract: A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 29, 2019
    Applicant: Thin Film Electronics ASA
    Inventors: Somnath MUKHERJEE, Aditi CHANDRA, Mao ITO, Arvind KAMATH, Scott BRUNER, Sambhu KUNDU, Anand DESHPANDE