Patents by Inventor Samson Lai

Samson Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RADIOLABELED COMPOUNDS TARGETING THE PROSTATE-SPECIFIC MEMBRANE ANTIGEN
    Publication number: 20240018110
    Abstract: The present invention relates to radiolabelled compounds for in vivo imaging or treatment of diseases or conditions characterized by expression of prostate-specific membrane antigen.
    Type: Application
    Filed: December 16, 2021
    Publication date: January 18, 2024
    Inventors: François BÉNARD, Kuo-Shyan LIN, Chengcheng ZHANG, David PERRIN, Aron ROXIN, Zhengxing ZHANG, Antoine DOUCHEZ, Pargol DANESHMANDKASHANI, Samson LAI
  • Control method and system for an automated material handling system
    Patent number: 7024275
    Abstract: An automated material handling system for a semiconductor fabrication facility includes: at least one processing tool that performs a semiconductor fabrication process on semiconductor wafers, at least one stocker capable of holding at least one lot of semiconductor wafers, and first and second transports. The second transport moves a second lot of semiconductor wafers from the stocker to a loadport of the processing tool after a first lot of semiconductor wafers is processed by the tool. The first transport moves an empty vehicle into position to remove the first lot of semiconductor wafers from the tool while the second lot of semiconductor wafers is being moved. The first transport removes the first lot of semiconductor wafers from the tool with the vehicle while the second lot of semiconductor wafers is being moved.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: April 4, 2006
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventor: Samson Lai
  • Control method and system for an automated material handling system
    Publication number: 20050096784
    Abstract: An automated material handling system for a semiconductor fabrication facility includes: at least one processing tool that performs a semiconductor fabrication process on semiconductor wafers, at least one stocker capable of holding at least one lot of semiconductor wafers, and first and second transports. The second transport moves a second lot of semiconductor wafers from the stocker to a loadport of the processing tool after a first lot of semiconductor wafers is processed by the tool. The first transport moves an empty vehicle into position to remove the first lot of semiconductor wafers from the tool while the second lot of semiconductor wafers is being moved. The first transport removes the first lot of semiconductor wafers from the tool with the vehicle while the second lot of semiconductor wafers is being moved.
    Type: Application
    Filed: November 5, 2003
    Publication date: May 5, 2005
    Inventor: Samson Lai