Patents by Inventor Samuel A. Ciani

Samuel A. Ciani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding over integrated circuits
    Patent number: 6384486
    Abstract: An architecture and method of fabrication for an integrated circuit 200 having a bond pad 208; at least one portion of said integrated circuit disposed under said contact pad and electrically connected to said pad through a via 205; a combination of a bondable metal layer 207, a stress-absorbing metal layer 203, and a mechanically strengthened, electrically insulating layer 204; and said combination of layers separating said contact pad and said portion of said integrated circuit, and having sufficient thickness to protect said circuit from bonding impact.
    Type: Grant
    Filed: December 10, 1999
    Date of Patent: May 7, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Edgar R. Zuniga, Samuel A. Ciani
  • BONDING OVER INTEGRATED CIRCUITS
    Publication number: 20020000671
    Abstract: An architecture and method of fabrication for an integrated circuit having a bond pad; at lest one portion of said integrated circuit disposed under said contact pad and electrically connected to said pad through a via; a combination of a bondable metal layer, a stress-absorbing metal layer, and a mechanically strengthened, electrically insulating layer; and said combination of layers separating said contact pad and said portion of said integrated circuit, and having sufficient thickness to protect said circuit from bonding impact.
    Type: Application
    Filed: December 10, 1999
    Publication date: January 3, 2002
    Inventors: EDGAR R. ZUNIGA, SAMUEL A. CIANI