Patents by Inventor Samuel E. Kurtz

Samuel E. Kurtz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive aided transfer of chips
    Patent number: 4724030
    Abstract: A transfer pin (40) simultaneously transfers a die (10) to an adhesively ted, electrically conductive cup (23) while depositing adhesive on the upper surface of the die for subsequent bonding.
    Type: Grant
    Filed: May 17, 1985
    Date of Patent: February 9, 1988
    Assignee: American Telephone and Telegraph Company AT&T Technologies, Inc.
    Inventor: Samuel E. Kurtz
  • Microelectronic device
    Patent number: 4375606
    Abstract: A method of bonding microelectronic components (10, 23, 24) is disclosed. A light emitting diode (10) is bonded to a conductive lead (24) and/or a portion of a lead frame (23) using an adhesive having no metallic particles therein. The diode (10) is clamped to the conductive lead (24) and/or the lead frame (23) as the epoxy is cured. Such bonds have been found to exhibit low contact resistance in addition to long life and reliability.
    Type: Grant
    Filed: January 18, 1982
    Date of Patent: March 1, 1983
    Assignee: Western Electric Co.
    Inventors: Daniel A. Di Leo, Samuel E. Kurtz, John J. Svitak
  • Method of fabricating a microelectronic device utilizing unfilled epoxy adhesive
    Patent number: 4209358
    Abstract: A method of bonding microelectronic components (10, 23, 24) is disclosed. A light emitting diode (10) is bonded to a conductive lead (24) and/or a portion of a lead frame (23) using an adhesive having no metallic particles therein. The diode (10) is clamped to the conductive lead (24) and/or the lead frame (23) as the epoxy is cured. Such bonds have been found to exhibit low contact resistance in addition to long life and reliability.
    Type: Grant
    Filed: December 4, 1978
    Date of Patent: June 24, 1980
    Assignee: Western Electric Company, Incorporated
    Inventors: Daniel A. DiLeo, Samuel E. Kurtz, John J. Svitak
  • Method of forming light emitting device with direct contact lens
    Patent number: H445
    Abstract: A method of forming a direct contact lens on a light emitting device strure is disclosed which facilitates the formation of large arrays of light emitting devices. The method uses a printing fixture including a large number of vertically oriented pins which is dipped into a bath of a liquid epoxy material. The printing fixture is then placed over the array structures and lowered until the pins contact the diodes. When the printing fixture is subsequently raised, the lens material will adhere to the associated devices and flow to completely encapsulate the device and a substantial portion of the device mounting structure.
    Type: Grant
    Filed: November 29, 1985
    Date of Patent: March 1, 1988
    Assignee: American Telephone and Telegraph Company, AT&T Technologies, Incorporated
    Inventors: Anne B. Bock, Samuel E. Kurtz, Thomas E. Seibert