Patents by Inventor Samuel Kenneth Liem

Samuel Kenneth Liem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing printed circuit board
    Patent number: 6874675
    Abstract: A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: April 5, 2005
    Assignees: MEC Company Ltd.
    Inventors: Tetsuo Kida, Samuel Kenneth Liem
  • Method for manufacturing printed circuit board
    Publication number: 20040079791
    Abstract: A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.
    Type: Application
    Filed: July 9, 2003
    Publication date: April 29, 2004
    Applicant: MEC COMPANY LTD.
    Inventors: Tetsuo Kida, Samuel Kenneth Liem