Patents by Inventor Samuel Kidane
Samuel Kidane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10693024Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.Type: GrantFiled: June 25, 2018Date of Patent: June 23, 2020Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Mark D. Weigel, Mark A. Roehrig, Alan K. Nachtigal, Samuel Kidane, Andrew J. Henderson
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Publication number: 20180309005Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.Type: ApplicationFiled: June 25, 2018Publication date: October 25, 2018Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: MARK D. WEIGEL, MARK A. ROEHRIG, ALAN K. NACHTIGAL, SAMUEL KIDANE, ANDREW J. HENDERSON
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Patent number: 10038112Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.Type: GrantFiled: February 10, 2017Date of Patent: July 31, 2018Assignee: 3M Innovative Properties CompanyInventors: Mark D. Weigel, Mark A. Roehrig, Samuel Kidane, Michael D. Delmore, Tracie J. Berniard
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Patent number: 10038111Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.Type: GrantFiled: July 1, 2011Date of Patent: July 31, 2018Assignee: 3M Innovative Properties CompanyInventors: Mark D. Weigel, Mark A. Roehrig, Alan K. Nachtigal, Samuel Kidane, Andrew J. Henderson
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Patent number: 9997657Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.Type: GrantFiled: July 1, 2011Date of Patent: June 12, 2018Assignee: 3M Innovative Properties CompanyInventors: Mark D. Weigel, Mark A. Roehrig, Alan K. Nachtigal, Samuel Kidane, Andrew J. Henderson
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Publication number: 20170155006Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.Type: ApplicationFiled: February 10, 2017Publication date: June 1, 2017Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: MARK D. WEIGEL, MARK A. ROEHRIG, SAMUEL KIDANE, MICHAEL D. DELMORE, TRACIE J. BERNIARD
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Patent number: 9614113Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.Type: GrantFiled: July 30, 2012Date of Patent: April 4, 2017Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Mark D. Weigel, Mark A. Roehrig, Samuel Kidane, Michael D. Delmore, Tracie J. Berniard
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Publication number: 20160341854Abstract: A method of making a reflective tray that is useful in backlight modules for electronic devices comprises (a) providing a reflective tray template comprising a polymeric dielectric multilayer reflector on a compliant pad, the reflective tray template having a first major surface, an opposing major surface, and a reflective tray bottom area having corners; and (b) pressing a blade into the first major surface of the polymeric dielectric multilayer reflector along the perimeter of at least one side of the reflective tray bottom area to form a reflective tray side extending perpendicular to the reflective tray bottom area.Type: ApplicationFiled: December 18, 2014Publication date: November 24, 2016Inventors: Samuel KIDANE, James W. LAUMER, Karl K. STENSVAD
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Publication number: 20160284906Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.Type: ApplicationFiled: June 8, 2016Publication date: September 29, 2016Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: MARK D. WEIGEL, MARK A. ROEHRIG, ALAN K. NACHTIGAL, SAMUEL KIDANE, ANDREW J. HENDERSON
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Publication number: 20160029440Abstract: A roll with an inductively-heatable layer and with an induction heater disposed within an interior space of the roll so that the induction heater does not move with the rotation of the roll; and, devices and methods for using such a roll.Type: ApplicationFiled: March 5, 2014Publication date: January 28, 2016Applicant: 3 M INNOVATIVE PROPERTIES COMPANYInventors: Samuel Kidane, Karl K. Stensvad, Randy S. Bay
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Publication number: 20150243816Abstract: The present disclosure generally relates to methods of forming barrier assemblies. Some embodiments include application and removal of a protective layer followed by application of a topsheet. Some embodiments include application and removal of a protective layer including a release agent and a monomer.Type: ApplicationFiled: August 15, 2013Publication date: August 27, 2015Inventors: Aan K. Nachtigal, Andrew T. Ruff, Christopher S. Lyons, Guy D. Joly, Joseph C. Spagnola, Mark D. Weigel, Michael D. Delmore, Samuel Kidane, Thomas P. Lun
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Publication number: 20150224695Abstract: Apparatus and methods for injection molding, in which at least one portion of at least one cavity surface that defines a mold cavity, includes a thermally controllable array.Type: ApplicationFiled: June 26, 2013Publication date: August 13, 2015Inventors: Karl K. Stensvad, Stanley Rendon, Samuel Kidane
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Publication number: 20150214405Abstract: The present disclosure generally relates to methods of forming barrier assemblies. Some embodiments include application of an adhesive layer and/or a topsheet to protect the exposed uppermost layer of the barrier stack during roll-to-roll processing. Some embodiments include application of an adhesive layer and/or a topsheet before the exposed, uppermost layer of the barrier film contacts a solid surface or processing roll. Inclusion of an adhesive layer and/or a topsheet protects the oxide layer during processing, which creates an excellent barrier assembly that can be manufactured using roll-to-roll processing.Type: ApplicationFiled: August 15, 2013Publication date: July 30, 2015Inventors: Alan K. Nachtigal, Andrew T. Ruff, Christopher S. Lyons, Guy D. Joly, Joseph C. Spagnola, Mark D. Weigel, Michael D. Delmore, Samuel Kidane, Thomas P. Klun
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Publication number: 20140283910Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film is transparent and flexible and the barrier stack and the substrate are insulated from the environment.Type: ApplicationFiled: July 30, 2012Publication date: September 25, 2014Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Mark D. Weigel, Mark A. Roehrig, Samuel Kidane, Andrew T. Ruff, Michael D. Delmore
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Publication number: 20140230892Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film has been fused.Type: ApplicationFiled: July 31, 2012Publication date: August 21, 2014Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Mark D. Weigel, Samuel Kidane
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Publication number: 20140224327Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.Type: ApplicationFiled: July 30, 2012Publication date: August 14, 2014Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Mark D. Weigel, Mark A. Roehrig, Samuel Kidane, Michael D. Delmore, Tracie J. Berniard
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Patent number: 8720052Abstract: A method of applying a conductive pattern of metal onto a web of indefinite length material. This method includes applying a metal containing composition onto the web in a predefined pattern, providing a roll having a very low thermal mass, and conveying the patterned web around the roll while simultaneously applying heat energy to the metal containing composition thereby converting the metal to a conductive pattern. This allows for flexible circuitry to be fabricated in an inexpensive roll-to-roll process.Type: GrantFiled: May 20, 2009Date of Patent: May 13, 2014Assignee: 3M Innovative Properties CompanyInventors: Daniel J. Theis, Brian K. Nelson, James N. Dobbs, Samuel Kidane, Ronald P. Swanson, Daniel H. Carlson, Grant F. Tiefenbruck, Karl K. Stensvad
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Patent number: 8663537Abstract: A heatsink for use in injection molding, with at least one load-bearing path with a rearward segment, wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the heatsink is laterally offset from the rearward segment of the load-bearing path.Type: GrantFiled: May 18, 2012Date of Patent: March 4, 2014Assignee: 3M Innovative Properties CompanyInventors: Karl K. Stensvad, Stanley Rendon, Paul A. Martinson, Samuel Kidane, Thomas Herdtle
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Publication number: 20130307189Abstract: A heatsink for use in injection molding, with at least one load-bearing path with a rearward segment, wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the heatsink is laterally offset from the rearward segment of the load-bearing path.Type: ApplicationFiled: May 18, 2012Publication date: November 21, 2013Inventors: Karl K. Stensvad, Stanley Rendon, Paul A. Martinson, Samuel Kidane, Thomas Herdtie
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Publication number: 20120003448Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.Type: ApplicationFiled: July 1, 2011Publication date: January 5, 2012Inventors: Mark D. Weigel, Mark A. Roehrig, Alan K. Nachtigal, Samuel Kidane, Andrew J. Henderson