Patents by Inventor Samuel Lytwynec

Samuel Lytwynec has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free solder paste with mixed solder powders for high temperature applications
    Patent number: 11738411
    Abstract: Some implementations of the disclosure relate to a lead-free solder paste with mixed solder powders that is particularly suitable for high temperature soldering applications involving multiple board-level reflow operations. In one implementation, the solder paste consists of 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of an SnSbCuAg solder alloy that has a wt % ratio of Sn:Sb of 0.75 to 1.1; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn solder alloy including at least 80 wt % of Sn; and a remainder of flux.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: August 29, 2023
    Assignee: INDIUM CORPORATION
    Inventors: Hongwen Zhang, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis M. Mutuku, Ning-Cheng Lee
  • LEAD-FREE SOLDER PASTE WITH MIXED SOLDER POWDERS FOR HIGH TEMPERATURE APPLICATIONS
    Publication number: 20210339344
    Abstract: Some implementations of the disclosure relate to a lead-free solder paste with mixed solder powders that is particularly suitable for high temperature soldering applications involving multiple board-level reflow operations. In one implementation, the solder paste consists of 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of an SnSbCuAg solder alloy that has a wt % ratio of Sn:Sb of 0.75 to 1.1; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn solder alloy including at least 80 wt % of Sn; and a remainder of flux.
    Type: Application
    Filed: April 29, 2021
    Publication date: November 4, 2021
    Inventors: Hongwen Zhang, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis M. Mutuku, Ning-Cheng Lee