Abstract: A method for testing integrated circuit devices and loading such devices into a test board for further testing and an apparatus therefor is disclosed. The method allows for selection between two modes of operation. In a first mode, the integrated circuit devices are subjected to an electrical test before being placed into the test board for further testing. In a second mode, the integrated circuit devices are tested after being placed in the test board. The apparatus allows for the selection between the first mode and the second mode. In either mode, information about the tested devices and the sockets in the test board is used to load the test boards intelligently. Intelligent loading means that devices under test (DUTs) are not placed in bad sockets and devices that do test bad are removed from the test board, with an option of replacing the failed DUT with another DUT before subsequent environmental testing of the DUTs in the test board is carried out.

Abstract: A re-usable carrier having a cavity for receiving unpackaged die with molded metallized probe heads to establish contact with the bond pads of the die, enabling the die to be functionally tested through the existing test systems. The novel carrier has metallized contacts for making electrical connection between the bare die and the perimeter of the carrier. The circuitry for electrically connecting the die and the perimeter of the carrier can be molded and plated into the base or printed on polymeric film. The base or integrated cover-base of the carrier may be from injection or press molded thermoplastic or press molded from ceramic to conform to any intended package for the die. The object is to adapt the carrier to the existing test equipment for burn-in stress and electrical tests for the intended package design without having to modify the hardware. The carrier may be plugged into a burn-in socket for burn-in stress testing and inserted onto an automatic test handler for electrical testing.