Abstract: A bandgap reference circuit includes a first diode-coupled transistor having a first control terminal and first and second current terminals and a second transistor having a second control terminal and third and fourth current terminals. The second control terminal is coupled to the first control terminal. A third transistor have a third control terminal and fifth and sixth current terminals. A fourth diode-coupled transistor has a fourth control terminal and seventh and eighth current terminals. The fourth control terminal is coupled to the third control terminal. An operational amplifier has a first input, a second input, and an output. The output is coupled to the first current terminal. A first resistor is coupled between the output and the third current terminal. A second resistor is coupled between the sixth and eighth current terminals.

Abstract: A system and method for managing software services is provided. The method includes receiving a query from a client device, by a processing unit, for accessing software package corresponding to at least one building block stored in a repository, wherein the building block is a software component associated with a software service, configured for reuse in a plurality of engineering applications. The method further includes identifying the software package corresponding to the building block from the repository based on the query. The method further includes providing access to the software package corresponding to the building block, on the client device, through an integrated development environment.

Abstract: A wafer carrier includes a base including a generally planar bottom surface and a top surface that includes a plurality of platforms extending above the top surface. The wafer carrier includes a thermal cover defining a plurality of pockets. The thermal cover is configured to be coupled to the base by at least one fastener and the plurality of pockets are arranged such that each pocket of the plurality of pockets is aligned with a corresponding platform of the plurality of the platforms when the thermal cover is supported by a plurality of first pedestals that extend from the top surface of the base. A plurality of second pedestals are located along the plurality of platforms for supporting the one or more wafers, wherein each platform includes at least one second pedestal that extends from a top surface of the platform for supporting one wafer.

Abstract: A wafer carrier assembly as described herein improves thermal control across a top surface thereof to maintain highly controlled deposition locations and thicknesses.

Abstract: A system and method for managing software services is provided. The method includes receiving a query from a client device, by a processing unit, for accessing software package corresponding to at least one building block stored in a repository, wherein the building block is a software component associated with a software service, configured for reuse in a plurality of engineering applications. The method further includes identifying the software package corresponding to the building block from the repository based on the query. The method further includes providing access to the software package corresponding to the building block, on the client device, through an integrated development environment.

Abstract: A self-centering split substrate carrier that supports a semiconductor substrate in a CVD system includes a first section configured to be centrally located in the split substrate carrier having a top surface with a recessed area for receiving a substrate for CVD processing and comprising a plurality of apertures positioned in an outer surface. A second section formed in a ring-shape having an inner surface configured to receive the first section and an outer surface configured to interface with an edge drive rotation mechanism that rotates the substrate carrier. The inner surface comprising a plurality of boss structures, wherein a respective one of the plurality of boss structures on the inner surface of the second section is configured to fit into a respective one of the plurality of apertures positioned in the outer surface of the first section, so as to improve alignment of the first and the second section of the self-centering split substrate carrier.

Abstract: A method and system for managing an operation associated with an object in an Internet of things (IoT) enabled device in an IoT environment are provided. The method includes receiving the object intended for the target IoT device from a remote system. The method also includes determining a criticality index associated with the object based on a set of pre-determined parameters associated with the object. The method includes initiating operation associated with the object by the target IoT device based on the determined criticality index.

Abstract: A substrate reactor with centering pin for epitaxial deposition includes a vacuum chamber and a tube configured to rotate in the vacuum chamber around a tube geometrical center axis. A substrate carrier forming a pocket dimensioned for holding a substrate on a top surface includes an aperture that is centrally located on a bottom surface. The substrate carrier is positioned on and in contact with a top surface of the tube. A centering pin is positioned along a geometrical center axis of rotation of the substrate carrier. The centering pin has a first end positioned in the aperture on the bottom surface of the substrate carrier and a second end fixed inside the reactor so that the substrate carrier rotates around the geometrical center axis of the substrate carrier independent of the geometrical center axis of the tube.

Abstract: A wafer carrier for use in a chemical vapor deposition (CVD) system includes a plurality of wafer retention pockets, each having a peripheral wall surface surrounding a floor surface and defining a periphery of that wafer retention pocket. Each wafer retention pocket has a periphery with a shape defined by at least a first arc having a first radius of curvature situated around a first arc center and a second arc having a second radius of curvature situated around a second arc center. The second arc is different from the first arc, either by its radius of curvature, arc center, or both.

Abstract: Systems and methods for transaction type categorization for enhanced servicing of peer-to-peer transactions are provided. A transaction processing application running on a communication device in communication with an electronic payment provider can generate a transaction request indicating parameters for processing a transaction with a first service and communicate the transaction request to the electronic payment provider. The application can receive an indication of transaction type categorization options to assign to the transaction based on an assessment of the parameters, and display a prompt indicating the transaction type categorization options for completing the transaction request.

Abstract: A method and system for managing an operation associated with an object in an Internet of things (IoT) enabled device in an IoT environment are provided. The method includes receiving the object intended for the target IoT device from a remote system. The method also includes determining a criticality index associated with the object based on a set of pre-determined parameters associated with the object. The method includes initiating operation associated with the object by the target IoT device based on the determined criticality index.

Abstract: A self-centering substrate carrier system for a chemical vapor deposition reactor includes a substrate carrier chosen to at least partially support a wafer for CVD processing and that comprises a beveled surface. A rotating tube comprising a beveled surface that matches the beveled surface of the substrate carrier, where a shape and dimensions of a cross section of the substrate carrier are chosen such that a center of mass of the substrate carrier is positioned a distance that is below a plane of contact defined by where a rim of substrate carrier contacts a rim of the rotating tube.

Abstract: A substrate carrier that supports a semiconductor substrate in a chemical vapor deposition system that includes a support having a beveled inner top surface including a top surface and a bottom surface. The top surface has a recessed area for receiving at least one substrate for chemical vapor deposition processing. The bottom surface has a beveled edge that forms a conical interface with the beveled inner top surface of the support at a self-locking angle that prevents substrate carrier movement in a vertical direction at a predetermined temperature equal to a maximum operation temperature. A coefficient of thermal expansion of a material forming the substrate carrier is substantially the same as a coefficient of thermal expansion of a material forming the support.

Abstract: A self-centering wafer carrier system for a chemical vapor deposition (CVD) reactor includes a wafer carrier comprising an edge. The wafer carrier at least partially supports a wafer for CVD processing. A rotating tube comprises an edge that supports the wafer carrier during processing. An edge geometry of the wafer carrier and an edge geometry of the rotating tube being chosen to provide a coincident alignment of a central axis of the wafer carrier and a rotation axis of the rotating tube during process at a desired process temperature.

Abstract: A self-centering wafer carrier system for a chemical vapor deposition (CVD) reactor includes a wafer carrier comprising an edge. The wafer carrier at least partially supports a wafer for CVD processing. A rotating tube comprises an edge that supports the wafer carrier during processing. An edge geometry of the wafer carrier and an edge geometry of the rotating tube being chosen to provide a coincident alignment of a central axis of the wafer carrier and a rotation axis of the rotating tube during process at a desired process temperature.

Abstract: A wafer carrier as described and claimed herein includes a thermal cover and a plurality of platforms with corresponding radially inner and outer pedestals.