Patents by Inventor Sandeep Kumar Goel
Sandeep Kumar Goel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11113444Abstract: Electronic design automation (EDA) of the present disclosure, in various embodiments, optimizes designing, simulating, analyzing, and verifying of electronic circuitry for an electronic device. The electronic device includes scan flip-flops to autonomously test the electronic circuitry for various manufacturing faults. The EDA of the present disclosure statistically groups the scan flip-flops into scan chains in such a manner such that scan flip-flops within each scan chain share similar characteristics, parameters, or attributes. Thereafter, the EDA of the present disclosure intelligently arranges ordering for the scan flip-flops within each of the scan chains to optimize power, performance, and/or area of the electronic circuitry.Type: GrantFiled: October 29, 2018Date of Patent: September 7, 2021Inventors: Sandeep Kumar Goel, Yun-Han Lee, Vinay Kotha, Ankita Patidar
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Patent number: 11068633Abstract: Process for determining defects in cells of a circuit is provided. A layout of a circuit is received. The layout comprises a first cell and a second cell separated by a boundary circuit. Bridge pairs for the first cell and the second cell is determined. The bridge pairs comprises a first plurality of boundary nodes of the first cell paired with a second plurality of boundary nodes of the second cell. Bridge pair faults between the bridge pairs are modeled. A test pattern for the bridge pair faults is generated.Type: GrantFiled: August 20, 2019Date of Patent: July 20, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Sandeep Kumar Goel, Ankita Patidar
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Publication number: 20210218577Abstract: A device includes a first memory circuit and a processing circuit. The first memory circuit is configured to store first hash data. The processing circuit is coupled to the first memory circuit. The processing circuit is configured to: at least based on a volume of the device, define a size of a distinguishable identification (ID) and a size of second hash data; based on a combination of at least one bit of each of the distinguishable ID and IDs of the device, generate the second hash data; and compare the first hash data with the second hash data, in order to identify whether the device is tampered. A method is also discloses herein.Type: ApplicationFiled: March 25, 2021Publication date: July 15, 2021Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Haohua ZHOU, Sandeep Kumar GOEL
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Patent number: 11055455Abstract: A method (of reducing errors in a migration a first netlist to a second netlist, the first and second netlists representing corresponding first and second implementations of a circuit design under corresponding first and second semiconductor process technology (SPT) nodes, at least the second netlist being stored on a non-transitory computer-readable medium), the method including: inspecting a timing constraint list for addition candidates, the timing constraint list corresponding to an initial netlist which represents the second implementation; relative to a logic equivalence check (LEC) context, increasing a number of comparison points based on the addition candidates, resulting in first version of the second netlist; performing a LEC between the first netlist and the first version of the second netlist, thereby identifying migration errors; and revising the first version of the second netlist to reduce the migration errors, thereby resulting in a second version of the second netlist.Type: GrantFiled: February 12, 2020Date of Patent: July 6, 2021Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., TSMC NANJING COMPANY, LIMITEDInventors: Sandeep Kumar Goel, Yun-Han Lee, Ankita Patidar
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Publication number: 20210192112Abstract: A method (of reducing errors in a migration a first netlist to a second netlist, the first and second netlists representing corresponding first and second implementations of a circuit design under corresponding first and second semiconductor process technology (SPT) nodes, at least the second netlist being stored on a non-transitory computer-readable medium), the method including: inspecting a timing constraint list for addition candidates, the timing constraint list corresponding to an initial netlist which represents the second implementation; relative to a logic equivalence check (LEC) context, increasing a number of comparison points based on the addition candidates, resulting in first version of the second netlist; performing a LEC between the first netlist and the first version of the second netlist, thereby identifying migration errors; and revising the first version of the second netlist to reduce the migration errors, thereby resulting in a second version of the second netlist.Type: ApplicationFiled: February 12, 2020Publication date: June 24, 2021Inventors: Sandeep Kumar GOEL, Yun-Han LEE, Ankita PATIDAR
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Patent number: 11025261Abstract: A clock distribution circuit configured to output a clock signal includes a first circuit configured to use a reference clock signal to provide first and second reference signals, wherein the second reference signal indicates whether the first reference signal is locked with the reference clock signal; a second circuit configured to use the reference clock signal to provide an output signal and an indication signal indicative whether the output signal is locked with the reference clock signal; and a monitor circuit, coupled to the first and second circuits, and configured to use at least one of the first reference signal, the second reference signal, the output signal, and the indication signal to determine whether the second circuit is functioning correctly.Type: GrantFiled: June 5, 2020Date of Patent: June 1, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Sandeep Kumar Goel, Ji-Jan Chen, Stanley John, Yun-Han Lee, Yen-Hao Huang
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Patent number: 10985922Abstract: A device includes a first memory circuit, a second memory circuit and a processing circuit. The memory circuit is configured to store a distinguishable identification (ID). The second memory circuit is configured to store first hash data, wherein the first hash data is generated according to the distinguishable ID. The processing circuit is configured to generate second hash data according to the distinguishable ID when the device is powered on, and to compare the first hash data and the second hash data to determine whether the second hash data matches the first hash data.Type: GrantFiled: February 27, 2018Date of Patent: April 20, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Haohua Zhou, Sandeep Kumar Goel
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Publication number: 20210089696Abstract: A method includes receiving a source code for executing a plurality of operations associated with a machine learning algorithm, classifying each operation into a fast operation group and/or a slow operation group, defining a neuron network for executing operations of the slow operation group, and mapping the neuron network to an initial machine learning hardware configuration. The method also includes executing the slow operation group operation on the machine learning hardware configuration, finalizing the machine learning hardware configuration capable of successfully executing least one test data set.Type: ApplicationFiled: December 8, 2020Publication date: March 25, 2021Inventors: Kai-Yuan TING, Sandeep Kumar GOEL, Tze-Chiang HUANG, Yun-Han LEE
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Publication number: 20200410144Abstract: Electronic system level (ESL) design and verification of the present disclosure is utilized to provide an electronic simulation and modeling of function safety and fault management of an electronic device. A method for simulating a safety circuit includes providing an electronic architectural design to perform one or more functional behaviors of the electronic device in accordance with an electronic design specification. The method further includes modeling the safety circuit of the electronic architectural design and one or more other electronic circuits of the electronic architectural design that communicate with the safety circuit. The method further includes simulating, using the modeling, operation of the safety circuit while the electronic architectural design is performing the one or more functional behaviors. The method also includes determining whether the simulated operation of the safety circuit satisfies the electronic design specification.Type: ApplicationFiled: September 14, 2020Publication date: December 31, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kai-Yuan TING, Sandeep Kumar GOEL, Yun-Han LEE, Mei WONG, Hsin-Cheng CHEN
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Patent number: 10871518Abstract: Methods and systems for determining a systematic defect in a circuit under test is provided. Elements of the circuit under test converted into scan cells. A first scan chain that includes a first plurality of scan cells is formed. Each scan cell of the first plurality of scan cells of the first scan chain are of a first cell type. The first scan chain contains a first scan input and a first scan output. A first test pattern is applied at the scan input and a first test output is collected for the applied first test pattern at the first scan output. The collected first test output is compared with a first expected test output. The first cell type is marked to be a suspect for a systematic defect when the first test output is different from the first expected test output.Type: GrantFiled: September 12, 2018Date of Patent: December 22, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Sandeep Kumar Goel, Yun-Han Lee, Ankita Patidar
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Patent number: 10867098Abstract: A method includes receiving a source code for executing a plurality of operations associated with a machine learning algorithm, classifying each operation into a fast operation group or a slow operation group, defining a neuron network for executing operations of the slow operation group, and mapping the neuron network to an initial machine learning hardware configuration. The method also includes executing operations of the slow operation group on the initial machine learning hardware configuration, modifying the initial machine learning hardware configuration in response to a determination that the slow group operation fails to produce an expected result in response to at least one set of inputs; and executing a fast group operation using a machine learning software code.Type: GrantFiled: September 25, 2019Date of Patent: December 15, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kai-Yuan Ting, Sandeep Kumar Goel, Tze-Chiang Huang, Yun-Han Lee
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Patent number: 10867089Abstract: Electronic system level (ESL) design and verification of the present disclosure is utilized to provide an electronic simulation of various loads on one or more batteries of an electronic device resulting from the electronic device performing one or more functional behaviors. Before this electronic simulation occurs, the electronic device is modeled using the high-level software language or the high-level software format. For example, a battery discharge model, a regulator efficiency model, a power delivery network (PDN) model, or a component power model are used to model behaviors of the one or more batteries, regulator circuitry, power delivery network (PDN) circuitry, and other electronic circuits, respectively, of the electronic device.Type: GrantFiled: July 19, 2017Date of Patent: December 15, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Charlie Zhou, Kai-Yuan Ting, Sandeep Kumar Goel, Tze-Chiang Huang, Yun-Han Lee
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Publication number: 20200379013Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.Type: ApplicationFiled: August 18, 2020Publication date: December 3, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mill-Jer Wang, Ching-Fang Chen, Sandeep Kumar Goel, Chung-Sheng Yuan, Chao-Yang Yeh, Chin-Chou Liu, Yun-Han Lee, Hung-Chih Lin
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Publication number: 20200372124Abstract: A method includes receiving a source code for executing a plurality of operations associated with a machine learning algorithm, classifying each operation into a fast operation group or a slow operation group, defining a neuron network for executing operations of the slow operation group, and mapping the neuron network to an initial machine learning hardware configuration. The method also includes executing operations of the slow operation group on the initial machine learning hardware configuration, modifying the initial machine learning hardware configuration in response to a determination that the slow group operation fails to produce an expected result in response to at least one set of inputs; and executing a fast group operation using a machine learning software code.Type: ApplicationFiled: September 25, 2019Publication date: November 26, 2020Inventors: Kai-Yuan TING, Sandeep Kumar GOEL, Tze-Chiang HUANG, Yun-Han LEE
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Publication number: 20200311329Abstract: Methods of a scan partitioning a circuit are disclosed. One method includes calculating a power score for circuit cells within a circuit design based on physical cell parameters of the circuit cells. For each of the circuit cells, the circuit cell is assigned to a scan group according to the power score for the circuit cell and a total power score for each scan group. A plurality of scan chains is formed. Each of the scan chains is formed from the circuit cells in a corresponding scan group based at least in part on placement data within the circuit design for each of the circuit cells. Interconnect power consumption can be assessed to determine routing among circuit cells in the scan chains.Type: ApplicationFiled: June 15, 2020Publication date: October 1, 2020Inventors: Ankita Patidar, Sandeep Kumar Goel, Yun-Han Lee
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Publication number: 20200304133Abstract: A clock distribution circuit configured to output a clock signal includes a first circuit configured to use a reference clock signal to provide first and second reference signals, wherein the second reference signal indicates whether the first reference signal is locked with the reference clock signal; a second circuit configured to use the reference clock signal to provide an output signal and an indication signal indicative whether the output signal is locked with the reference clock signal; and a monitor circuit, coupled to the first and second circuits, and configured to use at least one of the first reference signal, the second reference signal, the output signal, and the indication signal to determine whether the second circuit is functioning correctly.Type: ApplicationFiled: June 5, 2020Publication date: September 24, 2020Inventors: Sandeep Kumar GOEL, Ji-Jan CHEN, Stanley JOHN, Yun-Han LEE, Yen-Hao HUANG
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Patent number: 10782318Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.Type: GrantFiled: October 20, 2017Date of Patent: September 22, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mill-Jer Wang, Ching-Fang Chen, Sandeep Kumar Goel, Chung-Sheng Yuan, Chao-Yang Yeh, Chin-Chou Liu, Yun-Han Lee, Hung-Chih Lin
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Patent number: 10776538Abstract: Electronic system level (ESL) design and verification of the present disclosure is utilized to provide an electronic simulation and modeling of function safety and fault management of an electronic device. A method for simulating a safety circuit includes providing an electronic architectural design to perform one or more functional behaviors of the electronic device in accordance with an electronic design specification. The method further includes modeling the safety circuit of the electronic architectural design and one or more other electronic circuits of the electronic architectural design that communicate with the safety circuit. The method further includes simulating, using the modeling, operation of the safety circuit while the electronic architectural design is performing the one or more functional behaviors. The method also includes determining whether the simulated operation of the safety circuit satisfies the electronic design specification.Type: GrantFiled: August 31, 2017Date of Patent: September 15, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kai-Yuan Ting, Sandeep Kumar Goel, Yun-Han Lee, Mei Wong, Hsin-Cheng Chen
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Publication number: 20200280527Abstract: A network-on-chip (NoC) system includes a default communication path between a master device and a slave device, and a backup communication path between the master device and the slave device. The default communication path is configured to work in a normal operation state of the chip. The backup communication path is configured to replace the default communication path when a fault arises in the default communication path.Type: ApplicationFiled: May 20, 2020Publication date: September 3, 2020Inventors: RAVI VENUGOPALAN, SANDEEP KUMAR GOEL, YUN-HAN LEE
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Patent number: 10719648Abstract: A method is disclosed that includes providing an IP bank, an application bank, and a technology bank; generating a hierarchical table based on the IP bank and the application bank; performing an estimation of at least one of a performance value, a power value, an area value and a cost value, which corresponds to the hierarchical table, by using the technology bank, to output an result data as a basis of fabrication of a system.Type: GrantFiled: September 8, 2016Date of Patent: July 21, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tze-Chiang Huang, Kai-Yuan Ting, Sandeep Kumar Goel, Yun-Han Lee, Shereef Shehata, Mei Wong