Patents by Inventor Sandra Rodriguez

Sandra Rodriguez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240083889
    Abstract: This invention relates to a synthetic method for the preparation of Compound 1 and precursors thereof. Compound 1 is prepared via reaction of isoxazole 2 with phenylether (R)-3-ONa.
    Type: Application
    Filed: August 24, 2023
    Publication date: March 14, 2024
    Inventors: Katrin BAER, Gisela BODENBACH, Jack Delbert BROWN, Rosemarie Karoline COLLET, Daniel HERKOMMER, Rogelio P. FRUTOS, Joe Ju GAO, Julia Regina GRIMM, Sandra KOCH, Sonia RODRIGUEZ, Svetlana SEHL-OLLENBERGER, Joshua Daniel SIEBER, Thomas G. TAMPONE, Ulrich THEIS, Dirk WEBER, Erik WEIS, Anke WILD
  • Publication number: 20230011220
    Abstract: A metal powder having a composition including the following elements, expressed in content by weight: 6.5%?Si?10%, 4.5%?Nb?10%, 0.2%?B?2.0%, 0.2%?Cu?2.0%, C?2% and optionally containing Ni?10 wt % and/or Co?10 wt % and/or Cr?7 wt % and/or Zr as a substitute for any part of Nb on a one-to-one basis and/or Mo as a substitute for any part of Nb on a one-to-one basis and/or P as a substitute for any part of Si on a one-to-one basis, the balance being Fe and unavoidable impurities resulting from the elaboration, the metal powder having a microstructure including at least 5% in area fraction of an amorphous phase, the balance being made of crystalline ferritic phases with a grain size below 20 ?m and possible precipitates, the metal powder having a mean sphericity SPHT of at least 0.80.
    Type: Application
    Filed: December 18, 2020
    Publication date: January 12, 2023
    Inventors: Manuel SANCHEZ PONCELA, Nele VAN STEENBERGE, Florencia GATTI, Sandra RODRIGUEZ
  • Publication number: 20220398715
    Abstract: In a method for enhancing accuracy and efficiency in automated visual inspection of vessels, a vessel containing a sample is oriented such that a line scan camera has a profile view of an edge of a stopper of the vessel. A plurality of images of the edge of the stopper is captured by the first line scan camera while spinning the vessel, where each image of the plurality of images corresponds to a different rotational position of the vessel. A two-dimensional image of the edge of the stopper is generated based on at least the plurality of images, and pixels of the two-dimensional image are processed, by one or more processors executing an inference model that includes a trained neural network, to generate output data indicative of a likelihood that the sample is defective.
    Type: Application
    Filed: November 6, 2020
    Publication date: December 15, 2022
    Inventors: Neelima Chavali, Thomas C. Pearson, Manuel A. Soto, Jorge Delgado Torres, Roberto C. Alvarado Rentas, Javier O. Tapia, Sandra Rodriguez-Toledo, Eric R. Flores-Acosta, Osvaldo Perez, Brenda A. Torres
  • Publication number: 20220253580
    Abstract: Fluid modeling methods and systems are provided for predicting phase behavior of petroleum fluids using a computational model that employs pseudo-components of varying carbon numbers that represent asphaltenes, asphaltene-like hydrocarbon, and non-asphaltene hydrocarbons. The computational model models the phase equilibria of the mixture of components with mixing rules that employ binary interaction parameters determined from correlations that involve certain properties or parameters associated with respective pseudo-component pairs as input variables. The binary interaction parameters are tuned by adjusting at least one parameter of the respective correlations based on matching at least one measured property of one or more petroleum fluids to a corresponding property predicted by the computational model for the one or more petroleum fluids. The tuned values for the binary interaction parameters can be stored as part of the computational model for subsequent fluid modeling.
    Type: Application
    Filed: February 5, 2021
    Publication date: August 11, 2022
    Inventors: Sandra Rodriguez Leon, Glen Andrew Hay, Kurt Andreas George Schmidt
  • Publication number: 20210348161
    Abstract: The present invention relates to a method for eliminating cancer cells, wherein said cells comprise a genomic rearrangement which leads either to the expression of a fusion gene not present in non-cancer cells, or to genomic amplifications or rearrangements which lead to the induction of the expression or to the overexpression of a cancer inducing gene, said method comprising: (a) cleaving the genome in at least two sites, said cleavage leading to either a deletion, an inversion, a frameshift, the cleavage without repair and/or an insertion in the genome of said cancer cells, and/or (b) cleaving the expression product of said fusion gene or cancer inducing gene in at least one site.
    Type: Application
    Filed: October 18, 2019
    Publication date: November 11, 2021
    Inventors: Sandra RODRIGUEZ PERALES, Raúl TORRES RUIZ, Marta MARTINEZ-LAGE
  • Patent number: 10546821
    Abstract: An integrated circuit and method with a delamination free opening formed through multiple levels of polymer dielectric. The opening has a vertical sidewall and no interface between adjacent levels of polymer dielectric is exposed on the vertical sidewall.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: January 28, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Licheng Marshal Han, Michael Andrew Serafin, Byron Williams, Sandra Rodriguez Varela, Salvatore Pavone
  • Publication number: 20170033057
    Abstract: An integrated circuit and method with a delamination free opening formed through multiple levels of polymer dielectric. The opening has a vertical sidewall and no interface between adjacent levels of polymer dielectric is exposed on the vertical sidewall.
    Type: Application
    Filed: October 14, 2016
    Publication date: February 2, 2017
    Inventors: Licheng Marshal Han, Michael Andrew Serafin, Byron Williams, Sandra Rodriguez Varela, Salvatore Pavone
  • Patent number: 9502365
    Abstract: An integrated circuit and method with a delamination free opening formed through multiple levels of polymer dielectric. The opening has a vertical sidewall and no interface between adjacent levels of polymer dielectric is exposed on the vertical sidewall.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: November 22, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Licheng Marshal Han, Michael Andrew Serafin, Byron Williams, Sandra Rodriguez Varela, Salvatore Pavone
  • Publication number: 20150187711
    Abstract: An integrated circuit and method with a delamination free opening formed through multiple levels of polymer dielectric. The opening has a vertical sidewall and no interface between adjacent levels of polymer dielectric is exposed on the vertical sidewall.
    Type: Application
    Filed: December 19, 2014
    Publication date: July 2, 2015
    Inventors: Licheng Marshal Han, Michael Andrew Serafin, Byron Williams, Sandra Rodriguez Varela, Salvatore Pavone
  • Patent number: 7638275
    Abstract: Genetically elite ungulate mammals are identified on the basis of gene expression profiles from biological samples such as liver and blood. Methods and compositions are presented to select genetically elite animals with a desired phenotype such as high milk production for breeding to improve production levels. A method to select an animal with a specific phenotype, e.g. milk production and health traits, includes creating a Gene Expression Index for a specific phenotype and using the index to identify candidate animals for breeding by comparing the index to gene expression profiles of the animals.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: December 29, 2009
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Harris A. Lewin, Zonglin Liu, Sandra Rodriguez-Zas, Robin E. Everts
  • Patent number: 7138726
    Abstract: A package includes a first and a second wafer stored therein in a stacked configuration. The first wafer has interconnection conductor material portions extending from a first surface thereof. The interconnection conductor material portions have a maximum height. An interleaf member is located between the first and second wafers. A first recessed portion is formed in the interleaf member, and it has an outer perimeter shape corresponding to an outer perimeter shape of the first wafer. The first recessed portion has a first depth from a top surface of the interleaf member. A second recessed portion is formed in the interleaf member and located at least partially within the first recessed portion, and it has a bottom surface at a second depth from the top surface. The second depth is greater than the first depth. The second depth minus the first depth is greater than the maximum height.
    Type: Grant
    Filed: August 9, 2005
    Date of Patent: November 21, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Gonzalo Amador, Sandra Rodriguez
  • Publication number: 20060073633
    Abstract: A package includes a first and a second wafer stored therein in a stacked configuration. The first wafer has interconnection conductor material portions extending from a first surface thereof. The interconnection conductor material portions have a maximum height. An interleaf member is located between the first and second wafers. A first recessed portion is formed in the interleaf member, and it has an outer perimeter shape corresponding to an outer perimeter shape of the first wafer. The first recessed portion has a first depth from a top surface of the interleaf member. A second recessed portion is formed in the interleaf member and located at least partially within the first recessed portion, and it has a bottom surface at a second depth from the top surface. The second depth is greater than the first depth. The second depth minus the first depth is greater than the maximum height.
    Type: Application
    Filed: August 9, 2005
    Publication date: April 6, 2006
    Inventors: Gonzalo Amador, Sandra Rodriguez
  • Patent number: 6926150
    Abstract: A package includes a first and a second wafer stored therein in a stacked configuration. The first wafer has interconnection conductor material portions extending from a first surface thereof. The interconnection conductor material portions have a maximum height. An interleaf member is located between the first and second wafers. A first recessed portion is formed in the interleaf member, and it has an outer perimeter shape corresponding to an outer perimeter shape of the first wafer. The first recessed portion has a first depth from a top surface of the interleaf member. A second recessed portion is formed in the interleaf member and located at least partially within the first recessed portion, and it has a bottom surface at a second depth from the top surface. The second depth is greater than the first depth. The second depth minus the first depth is greater than the maximum height.
    Type: Grant
    Filed: April 17, 2003
    Date of Patent: August 9, 2005
    Assignee: Texas Instruments Incorporated
    Inventors: Gonzalo Amador, Sandra Rodriguez
  • Publication number: 20050137805
    Abstract: Genetically elite ungulate mammals are identified on the basis of gene expression profiles from biological samples such as liver and blood. Methods and compositions are presented to select genetically elite animals with a desired phenotype such as high milk production for breeding to improve production levels. A method to select an animal with a specific phenotype, e.g. milk production and health traits, includes creating a Gene Expression Index for a specific phenotype and using the index to identify candidate animals for breeding by comparing the index to gene expression profiles of the animals.
    Type: Application
    Filed: May 27, 2004
    Publication date: June 23, 2005
    Inventors: Harris Lewin, Zonglin Liu, Sandra Rodriguez-Zas, Robin Everts
  • Publication number: 20040149623
    Abstract: A package includes a first and a second wafer stored therein in a stacked configuration. The first wafer has interconnection conductor material portions extending from a first surface thereof. The interconnection conductor material portions have a maximum height. An interleaf member is located between the first and second wafers. A first recessed portion is formed in the interleaf member, and it has an outer perimeter shape corresponding to an outer perimeter shape of the first wafer. The first recessed portion has a first depth from a top surface of the interleaf member. A second recessed portion is formed in the interleaf member and located at least partially within the first recessed portion, and it has a bottom surface at a second depth from the top surface. The second depth is greater than the first depth. The second depth minus the first depth is greater than the maximum height.
    Type: Application
    Filed: April 17, 2003
    Publication date: August 5, 2004
    Inventors: Gonzalo Amador, Sandra Rodriguez