Patents by Inventor Sandrio Elim

Sandrio Elim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nano thick Pt metallization layer
    Patent number: 8569889
    Abstract: A metallization layer for a semiconductor device includes a first layer made of Pt and having a thickness greater than or equal to 15 ? and less than or equal to 50 ?, and a second layer formed on the first layer and made of a plurality of metallic sub-layers such as Ti/Pt/Au. A semiconductor device fabricated from the metallization layer includes a semiconductor substrate having a top layer and mesa structure and corresponding surface for securing an insulating layer and a corresponding exposed surface, and wherein the metallization layer is deposited over the insulating layer and exposed surface. Methods for forming the metallization layer are also disclosed.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: October 29, 2013
    Assignee: nLIGHT Photonics Corporation
    Inventors: Shiguo Zhang, Sandrio Elim, Ling Bao