Abstract: Information processing system including a first and a second operation mode with operating current lower than the first, a register holding an address of an instruction executed by a processing unit first when a boot address register returns from second to first operation mode, wherein the address is output to the processing unit when second to first operation mode shifting, wherein the boot address register is rewritable, an information holding circuit holding a value of a peripheral circuit module register, wherein the information holding circuit holds, in the second operation mode, information about the peripheral circuit module register, and, transfers information held in the information holding circuit to the peripheral circuit module register regarding a second-to-first operation mode shift, and wherein when an interrupt request is posted from outside the system in the second operation mode, the information processing system performs interrupt processing corresponding to the interrupt request.

Abstract: Information processing system including a first and a second operation mode with operating current lower than the first, a register holding an address of an instruction executed by a processing unit first when a boot address register returns from second to first operation mode, wherein the address is output to the processing unit when second to first operation mode shifting, wherein the boot address register is rewritable, an information holding circuit holding a value of a peripheral circuit module register, wherein the information holding circuit holds, in the second operation mode, information about the peripheral circuit module register, and, transfers information held in the information holding circuit to the peripheral circuit module register regarding a second-to-first operation mode shift, and wherein when an interrupt request is posted from outside the system in the second operation mode, the information processing system performs interrupt processing corresponding to the interrupt request.

Abstract: An information processing device, including: a processing unit; a peripheral circuit module; and a boot address register, wherein the information processing device comprises a first operation mode and a second operation mode having an operating current which is lower than that of said first operation mode, wherein the boot address register holds an address of an instruction to be executed by said processing unit first when the boot address register returns from said second operation mode to said first operation mode, wherein the address is output from said boot address to the processing unit when said information processing device shifts from said second operation mode to said first operation mode.

Abstract: A processing load of a high performance application processing such as a voice, an image and the like is reduced, and a processing capacity of a base band processing is improved. A semiconductor integrated circuit device used in a mobile communication system such as a cellular phone is provided with a base band CPU block performing a base band processing for executing a base band protocol stack, an application system CPU block executing a high-level OS and controlling applications other than the base band processing, an application real-time CPU block executing a real-time OS and the like and controlling an image/voice processing, all of which are formed on one semiconductor chip. Further, internal high-speed buses to which these CPU blocks are connected are respectively connected via bridges.

Abstract: Abstract An information processing device, including: a processing unit; a peripheral circuit module; and a boot address register, wherein the information processing device comprises a first operation mode and a second operation mode having an operating current which is lower than that of said first operation mode, wherein the boot address register holds an address of an instruction to be executed by said processing unit first when the boot address register returns from said second operation mode to said first operation mode, wherein the address is output from said boot address to the processing unit when said information processing device shifts from said second operation mode to said first operation mode.

Abstract: A mechanism of making a low standby current caused by power off compatible with a fast return operation from a standby caused by an interrupt is realized. An information processing device has a first area that includes a central processing unit and peripheral circuit modules, a second area having information holding circuits for holding values of registers contained in the peripheral circuit modules, and a first power switch for controlling supply of a current to the first area. When the information processing device operates in a first mode, an operating current is supplied to the first area and the second area. When the information processing device operates in a second mode, the first power switch is controlled so that the supply of the current to the first area can be shut off, and the supply of the current to the second area is continued.

Abstract: A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure.

Abstract: A processing load of a high performance application processing such as a voice, an image and the like is reduced, and a processing capacity of a base band processing is improved. A semiconductor integrated circuit device used in a mobile communication system such as a cellular phone is provided with a base band CPU block performing a base band processing for executing a base band protocol stack, an application system CPU block executing a high-level OS and controlling applications other than the base band processing, an application real-time CPU block executing a real-time OS and the like and controlling an image/voice processing, all of which are formed on one semiconductor chip. Further, internal high-speed buses to which these CPU blocks are connected are respectively connected via bridges.

Abstract: The present invention provides a semiconductor device having a stacked structure which realizes the miniaturization of a contour size and the reduction of thickness. The present invention also provides a semiconductor device which realizes high performance and high reliability in addition to the miniaturization of the contour size. The semiconductor device uses a package substrate on which bonding leads which are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads are formed. The semiconductor device further includes an address output circuit and a data input/output circuit which are also served for memory access and a signal processing circuit having a data processing function.

Abstract: A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure.

Abstract: A mechanism of making a low standby current caused by power off compatible with a fast return operation from a standby caused by an interrupt is realized. An information processing device has a first area that includes a central processing unit and peripheral circuit modules, a second area having information holding circuits for holding values of registers contained in the peripheral circuit modules, and a first power switch for controlling supply of a current to the first area. When the information processing device operates in a first mode, an operating current is supplied to the first area and the second area. When the information processing device operates in a second mode, the first power switch is controlled so that the supply of the current to the first area can be shut off, and the supply of the current to the second area is continued.

Abstract: The present invention provides a semiconductor device having a stacked structure which realizes the miniaturization of a contour size and the reduction of thickness. The present invention also provides a semiconductor device which realizes high performance and high reliability in addition to the miniaturization of the contour size. The semiconductor device uses a package substrate on which bonding leads which are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads are formed. The semiconductor device further includes an address output circuit and a data input/output circuit which are also served for memory access and a signal processing circuit having a data processing function.

Abstract: A data processor capable of supporting a plurality of page sizes without increasing the chip occupation area or the power consumption. This data processor for supporting a virtual memory is constructed of a set associative type cache memory having a plurality of banks having their index addresses shared, in which the virtual page size can be set for each page and which includes a TLB to be shared among the plural virtual pages set in various manners. This TLB is provided with a latch field for latching a pair of the virtual page number and the physical page number. The maximum size of the virtual page to be supported is set to the power of two of the minimum size, and the bank number of the TLB is set to no less than the power of two of the former.

Abstract: A data processor supporting associative writing and comprising an associative memory and a central processing unit, the associative memory being furnished in the address space managed by the central processing unit. Any of the entries in the memory is accessed when the address of the entry in question in the address space is designated. With associative writing supported, data is allowed to be written to the designated address if the searched address information retained in the entry at the designated address matches the corresponding information held in the write data upon comparison. The write data is inhibited from being written to the designated address in case of a mismatch between the two kinds of information.

Abstract: A data processor capable of supporting a plurality of page sizes without increasing the chip occupation area or the power consumption. This data processor for supporting a virtual memory is constructed of a set associative type cache memory having a plurality of banks having their index addresses shared, in which the virtual page size can be set for each page and which includes a TLB to be shared among the plural virtual pages set in various manners. This TLB is provided with a latch field for latching a pair of the virtual page number and the physical page number. The maximum size of the virtual page to be supported is set to the power of two of the minimum size, and the bank number of the TLB is set to no less than the power of two of the former.