Abstract: Proposed is an apparatus for measuring sealing strength. The apparatus includes a fixed plate, a moving plate on which a measurement object formed by bonding first and second specimens is mounted, and movably disposed on the fixed plate, and a load applier measuring a load applied to the first specimen to peel off the first specimen from the second specimen. The first specimen is peeled off from the second specimen while maintaining a predetermined peeling angle.

Abstract: An apparatus for manufacturing a pouch-type rechargeable battery includes a preforming portion forming a folding groove in a portion of a protrusion of the pouch-type rechargeable battery, a folding portion disposed on a rear end of the preforming portion and folding the protrusion along the folding groove, a rolling portion disposed on a rear end of the folding portion and pressing the folded protrusion, and a pressing portion disposed on a rear end of the rolling portion and fixing the folded protrusion.

Abstract: A peridynamic method having an added mirroring node according to embodiments of the present invention includes: a first step of calculating a shape tensor of a first node; a second step of calculating force state vectors of the first node and each of a plurality of second nodes by using the shape tensor; and a third step of calculating a peridynamic motion equation of the first node by using the force state vectors. The first node is a node located on a boundary of a structure and has a predetermined size horizon region, the plurality of second nodes is nodes in the horizon region, the plurality of second nodes includes one or more third nodes, and the third node is a second node having no node at a point which is origin-symmetrical based on the first node among the plurality of second nodes. In the first step, the shape tensor is calculated by using a position value in which the third node is origin-symmetrical based on the first node.

Abstract: A solder ball grid array carrier package has a circuit board with conductive wirings and a plurality of through holes. At least one semiconductor chip is mounted on an upper surface of the circuit board and bonding wires electrically connect the chip to the conductive wirings. A plurality of solder balls are electrically connected to the conductive wirings, with the solder balls being adhered to a lower surface of the circuit board. A heat sink is also adhered to the lower surface of the circuit board. The heat sink is in direct contact with the through holes of the circuit board, with the through holes allowing for heat dissipation.