Patents by Inventor Sang Goo Kang
Sang Goo Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240190443Abstract: An apparatus for providing a vehicle sound includes a communicator configured to communicates with an electronic device, a detector configured to detect driver's driving pattern information and road driving condition information of a vehicle, and a controller coupled to the communicator and the detector. The controller is configured to obtain music information from the electronic device and calculate a music emotional quotient (EQ) index based on the music information, the driver's driving pattern information, and the road driving condition information. The controller is also configured to select a game sound type based on the music EQ index, and provide an emotional sound matched with the game sound type.Type: ApplicationFiled: July 12, 2023Publication date: June 13, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Ki Chang Kim, Sang Jin Hong, Dong Chul Park, Eun Soo Jo, Jeong Goo Kang
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Publication number: 20240194372Abstract: The present invention relates to an insulating gas used for electrical insulation or arc extinguishing of an electrical device, and an electrical device for insulating electricity using the same. The insulating gas of the present invention, which may replace SF6 gas, consists of a mixed gas of trifluoromethyl trifluorovinyl ether (CF3OCFCF2) and a carrier gas. The insulating gas of the present invention has the characteristics of a low boiling point, high dielectric strength, low toxicity, and a low global warming potential (GWP=1 or less), and thus may replace SF6, and the low global warming potential with no loss of high insulating capacity and arc extinguishing capability may reduce greenhouse gases.Type: ApplicationFiled: October 25, 2021Publication date: June 13, 2024Applicants: KOREA ELECTRO TECHNOLOGY RESEARCH INSTITUTE, KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGYInventors: Ki Dong SONG, Yeon Ho OH, Hyun Jae JANG, In Joon PARK, Won Wook SO, Shin Hong YOOK, Sang Goo LEE, Hong suk KANG, Ju Hyeon KIM, Ji Hoon BAIK, Eun Ho SOHN, Myoung Sook LEE, Bong Jun CHANG
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Publication number: 20240170721Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.Type: ApplicationFiled: January 21, 2022Publication date: May 23, 2024Inventors: Min Jung JANG, Min Goo KIM, Young Rok LIM, Ji Young CHOI, Sang Ho LEE, Wan Chul KANG, Jong Cheol YUN, Ji Seong HAN, Hee Jeong RYU, Jae Won CHUNG
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Publication number: 20240170304Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes treating modules having an opening for taking in and taking out a substrate and which are stacked on each other; and an air flow generating member for generating a downward airflow at each treating module, and wherein the air flow generating member includes: a pan unit configured to supply an air; a spray unit configured to be provided above the treating module and which sprays an air supplied from the pan unit; and an exhaust unit configured to exhaust an air sprayed by the spray unit to outside of the treating module.Type: ApplicationFiled: November 21, 2023Publication date: May 23, 2024Applicant: SEMES CO., LTD.Inventors: Ho Jong HWANG, Hyun Goo PARK, Hyo Won YANG, Ki-Moon KANG, Sang Min LEE, Se Hoon OH, Won Sik SON
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Publication number: 20240164147Abstract: A display device includes: a base substrate; a first pixel electrode, a second pixel electrode, and a third pixel electrode arranged on the base substrate to be spaced apart from each other; a pixel defining film on the first pixel electrode, the second pixel electrode, and the third pixel electrode and including a first opening exposing the first pixel electrode, a second opening exposing the second pixel electrode and spaced apart from the first opening, and a third opening exposing the third pixel electrode and spaced apart from the first opening and the second opening; a first organic layer on the first pixel electrode exposed by the first opening; a second organic layer on the second pixel electrode exposed by the second opening; and a third organic layer on the third pixel electrode exposed by the third opening.Type: ApplicationFiled: January 18, 2024Publication date: May 16, 2024Inventors: Sang Shin LEE, Joon Young PARK, Min Goo KANG, Jung Woo KO, Jong Sung PARK, Hong Kyun AHN, Sang Min YI, Sang Woo JO, Young Eun RYU, Yoon Seo LEE
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Publication number: 20240128510Abstract: The present invention relates to a novel electrolyte and a secondary battery including the same. The present invention has an effect of providing a secondary battery having improved charging efficiency and output due to reduced charging resistance and having excellent long-term lifespan and high-temperature capacity retention rate.Type: ApplicationFiled: December 24, 2021Publication date: April 18, 2024Inventors: Ji Young CHOI, Min Goo KIM, Sang Ho LEE, Wan Chul KANG, Jong Cheol YUN, Ji Seong HAN, Min Jung JANG
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Patent number: 11961775Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: November 8, 2022Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Patent number: 11963357Abstract: Provided is a nonvolatile memory device. The nonvolatile memory device includes a conductive plate, a barrier conductive film extending along a surface of the conductive plate, a mold structure including a plurality of gate electrodes sequentially stacked on the barrier conductive film, a channel hole penetrating the mold structure to expose the barrier conductive film, an impurity pattern being in contact with the barrier conductive film, and formed in the channel hole, and a semiconductor pattern formed in the channel hole, extending from the impurity pattern along a side surface of the channel hole, and intersecting the plurality of gate electrodes.Type: GrantFiled: December 14, 2022Date of Patent: April 16, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kohji Kanamori, Seo-Goo Kang, Hyo Joon Ryu, Sang Youn Jo, Jee Hoon Han
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Publication number: 20240101810Abstract: The present invention relates to a composition for forming a composite polymer film, a method for preparing the composition for forming a composite polymer film, a composite polymer film and a method for preparing the composite polymer film. The composition for forming a composite polymer film comprises: a fluorine-based polymer solution comprising a fluorine-based polymer; and polyvinylidene fluoride nanoparticles dispersed in the fluorine-based polymer solution. The method for preparing the composition for forming a composite polymer film comprises the steps of: preparing a fluorine-based polymer solution comprising a fluorine-based polymer; and dispersing polyvinylidene fluoride nanoparticles in the fluorine-based polymer solution. The composite polymer film comprises: a polymer matrix formed from a fluorine-based polymer; and polyvinylidene fluoride nanoparticles dispersed in the polymer matrix.Type: ApplicationFiled: September 4, 2020Publication date: March 28, 2024Applicants: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY, KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGYInventors: Eun Ho SOHN, Shin Hong YOOK, Hong Suk KANG, In Joon PARK, Sang Goo LEE, Soo Bok LEE, Won Wook SO, Hyeon Jun HEO, Dong Je HAN, Seon Woo KIM
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Publication number: 20240105991Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.Type: ApplicationFiled: January 21, 2022Publication date: March 28, 2024Inventors: Min Jung JANG, Min Goo KIM, Young Rok LIM, Ji Young CHOI, Sang Ho LEE, Wan Chul KANG, Jong Cheol YUN, Ji Seong HAN, Hee Jeong RYU, Jae Won CHUNG
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Publication number: 20240097190Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.Type: ApplicationFiled: January 21, 2022Publication date: March 21, 2024Inventors: Min Jung JANG, Min Goo KIM, Young Rok LIM, Ji Young CHOI, Sang Ho LEE, Wan Chul KANG, Jong Cheol YUN, Ji Seong HAN, Hee Jeong RYU, Jae Won CHUNG
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Publication number: 20240097188Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.Type: ApplicationFiled: January 21, 2022Publication date: March 21, 2024Inventors: Min Jung JANG, Min Goo KIM, Young Rok LIM, Ji Young CHOI, Sang Ho LEE, Wan Chul KANG, Jong Cheol YUN, Ji Seong HAN, Hee Jeong RYU, Jae Won CHUNG
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Publication number: 20240097189Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.Type: ApplicationFiled: January 21, 2022Publication date: March 21, 2024Inventors: Min Jung JANG, Min Goo KIM, Young Rok LIM, Ji Young CHOI, Sang Ho LEE, Wan Chul KANG, Jong Cheol YUN, Ji Seong HAN, Hee Jeong RYU, Jae Won CHUNG
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Publication number: 20240088114Abstract: An exemplary semiconductor device can comprise (a) a substrate comprising a substrate dielectric structure between the substrate top side and the substrate bottom side, conductive pads at the substrate bottom side, and a substrate cavity through the substrate dielectric structure, (b) a base electronic component comprising inner short bumps; outer short bumps bounding a perimeter around the inner short bumps, and tall bumps between the outer short bumps and an edge of the base component top side, and (c) a mounted electronic component coupled to the inner short bumps of the base electronic component. The tall bumps of the base component can be coupled to the conductive pads of the substrate. The mounted electronic component can be located in the substrate cavity. The substrate bottom side can cover at least a portion of the outer short bumps of the base electronic component. Other examples and related methods are disclosed herein.Type: ApplicationFiled: November 27, 2023Publication date: March 14, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyun Goo Cha, Dong Hee Kang, Sang Yun Ma, Sang Hyeok Cho, Jae Yeong Bae, Ron Huemoeller
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Publication number: 20230070922Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: ApplicationFiled: November 8, 2022Publication date: March 9, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Patent number: 11569163Abstract: Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process.Type: GrantFiled: October 11, 2021Date of Patent: January 31, 2023Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Seung Woo Lee, Byong Jin Kim, Won Bae Bang, Sang Goo Kang
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Patent number: 11495505Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: September 11, 2020Date of Patent: November 8, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Publication number: 20220130749Abstract: Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process.Type: ApplicationFiled: October 11, 2021Publication date: April 28, 2022Inventors: Seung Woo Lee, Byong Jin Kim, Won Bae Bang, Sang Goo Kang
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Patent number: 11145588Abstract: Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process.Type: GrantFiled: November 4, 2019Date of Patent: October 12, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Seung Woo Lee, Byong Jin Kim, Won Bae Bang, Sang Goo Kang
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Publication number: 20200411397Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: ApplicationFiled: September 11, 2020Publication date: December 31, 2020Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park