Abstract: Disclosed is a lower folding device for forming dumplings. The lower folding device for forming dumplings according to the present invention comprises: a dumpling skin pressing unit which includes a plurality of dumpling skin folding units that are simultaneously operated, and which drives the plurality of dumpling skin folding units at a preset position; a cam rail unit for folding which is arranged adjacent to the dumpling skin pressing unit and is connected to the dumpling skin pressing unit to move the dumpling skin folding units; and a movement unit for folding which is connected to the dumpling skin pressing unit and moves the dumpling skin pressing unit relative to the cam rail unit for folding.

Abstract: An in-line dumpling molding system is disclosed. The in-line dumpling molding system according to the present invention comprises: a dumpling wrapper cutting device, which cuts a supplied dough sheet to form dumpling wrappers; a dumpling-molding lower folding device, which is disposed below the dumpling wrapper cutting device, on which the cut dumpling wrappers are loaded, and which presses and folds the dumpling wrappers onto which dumpling fillings have been supplied; and a sealing device, which is disposed above the dumpling-molding lower folding device, and presses and seals the folded dumpling wrappers.

Abstract: An aluminum pouch film for a secondary battery is disclosed. The aluminum pouch film includes an aluminum film layer; an outer resin layer deposited on one surface of the aluminum film layer; and an inner resin layer deposited on the other surface of the aluminum film layer, wherein the inner resin layer comprises a polyolefin resin, an ethylene vinyl alcohol copolymer (EVOH) and a maleic anhydride polypropylene (MAHPP) resin.

Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.

Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.

Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.

Abstract: A display device includes a pixel electrode including silver, a pixel-defining film on the pixel electrode and exposing the pixel electrode, a barrier layer on the pixel electrode and the pixel-defining film and including a low-resistance area and a high-resistance area which has a higher resistance than the low-resistance area, an emission layer on the barrier layer, and a common electrode on the emission layer. The low-resistance area of the barrier layer overlaps with the pixel electrode, and the high-resistance area of the barrier layer overlaps with the pixel-defining film.

Abstract: Disclosed is a thermosetting resin composition for steel inserts, the composition including a thermosetting resin composite and a glass fiber. The thermosetting resin composite preferably includes 100 PHR of an unsaturated polyester resin, about 30 to 40 PHR of a low shrinkage agent, about 5 to 8 PHR of a release agent, about 130 to 140 PHR of a filler, about 2 to 8 PHR of a thickening agent, and about 1 to 2 PHR of a curing agent, based on 100 PHR of the unsaturated polyester resin. The thermosetting resin composition provides reduced costs and weight as compared to a steel material composed of only steel, and also exhibits physical properties comparable to the steel material.

Abstract: Disclosed is a thermosetting resin composition for steel inserts, the composition including a thermosetting resin composite and a glass fiber. The thermosetting resin composite preferably includes 100 PHR of an unsaturated polyester resin, about 30 to 40 PHR of a low shrinkage agent, about 5 to 8 PHR of a release agent, about 130 to 140 PHR of a filler, about 2 to 8 PHR of a thickening agent, and about 1 to 2 PHR of a curing agent, based on 100 PHR of the unsaturated polyester resin. The thermosetting resin composition provides reduced costs and weight as compared to a steel material composed of only steel, and also exhibits physical properties comparable to the steel material.