Patents by Inventor Sang-hak Yeo

Sang-hak Yeo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF PROCESSING SUBSTRATE
    Publication number: 20230343585
    Abstract: There is provided a method of processing a substrate that protects the photoresist pattern during the subsequent ion implanting process as well as improve the conformal properties. The method of processing the substrate includes steps of disposing a substrate in a reaction chamber, the substrate on which a photoresist pattern is formed; and forming a CD control film including a nitrogen-doped amorphous carbon on the substrate on which the photoresist pattern is formed, and the step of forming the CD control film may be performed at a temperature of 100° C. or less by a PECVD process.
    Type: Application
    Filed: April 26, 2023
    Publication date: October 26, 2023
    Applicant: TES Co., Ltd
    Inventors: Joo-Hyun PARK, Sang-Hak YEO, Jae-Ho LEE, Jae-Young YANG, Kwan-Woo LEE
  • Method for manufacturing protein chip substrate using plasma and protein chip substrate manufactured by the method
    Patent number: 7785649
    Abstract: Disclosed herein are a protein chip substrate and a method for manufacturing the protein chip substrate. The method includes deposition of plasma polymerized ethylenediamine (PPEDA) having an amine group on plasma polymerized cyclohexnane (PPCHex) by inductively coupled plasma-chemical vapor deposition (ICP-CVD), thereby preventing non-specific adsorption of proteins on a slide surface.
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: August 31, 2010
    Assignee: Sungkyunkwan University Foundation for Corporate Collaboration
    Inventors: Dong-geun Jung, Sang-hak Yeo, Chang-rok Choi
  • METHOD FOR MANUFACTURING PROTEIN CHIP SUBSTRATE USING PLASMA AND PROTEIN CHIP SUBSTRATE MANUFACTURED BY THE METHOD
    Publication number: 20070166815
    Abstract: Disclosed herein are a protein chip substrate and a method for manufacturing the protein chip substrate. The method includes deposition of plasma polymerized ethylenediamine (PPEDA) having an amine group on plasma polymerized cyclohexnane (PPCHex) by inductively coupled plasma-chemical vapor deposition (ICP-CVD), thereby preventing non-specific adsorption of proteins on a slide surface.
    Type: Application
    Filed: December 27, 2006
    Publication date: July 19, 2007
    Applicant: Sungkyunkwan Univ. Foundation For Corporate Coll.
    Inventors: Dong-geun Jung, Sang-hak Yeo, Chang-rok Choi